2010300214

Molex's 2010300214 sets new standards in Memory Connectors - PC Card Sockets for underwater communication systems. This pressure-compensated connector solution maintains perfect sealing at depths exceeding 6000 meters while delivering high-speed data transmission.Compatible with Combo - microSD™, NANO SIM protocols, the connector enables real-time data transfer from deep-sea sensors. Its oil-filled design compensates for external pressure without compromising signal integrity.The 15 (14 + 1) configuration supports simultaneous power and optical data transmission. The hybrid contact arrangement meets ISO 13628-6 standards for subsea equipment.The Connector and Ejector design features titanium housing with ceramic feedthroughs. This material combination withstands seawater corrosion while maintaining excellent dielectric properties.With Push In, Push Out operation, the connector enables mating underwater by ROVs. The pressure-balanced coupling system requires minimal insertion force at depth.The Left release mechanism functions reliably at extreme depths. The pressure-compensated ejector requires consistent force regardless of operating depth.The Surface Mount, Right Angle variant includes integrated strain relief for armored cables. The termination system maintains sealing integrity under 2000N axial load.The Switch include redundant sealing systems tested to 9000psi hydrostatic pressure. The connector exceeds API 17F requirements for subsea production equipment.The 0.057" (1.45mm) compact design fits within standard ROV tool skids. The low-profile geometry minimizes hydrodynamic drag in underwater applications.Available in Normal, Standard - Top configurations, the connector supports both wet-mate and dry-mate applications. The quick-connect version enables tool-less ROV intervention.The Gold plating has been tested for 500+ mating cycles in seawater. The corrosion-resistant surface treatment prevents biofouling in marine environments.With 2.00µin (0.051µm) gold plating, the contacts maintain stable resistance despite marine growth. The plating thickness has been optimized for both performance and durability.