2012-2X07G00S/028/043/J

Oupiin

General info

Part Number

Manufacturer

Oupiin

Description:

PIN HEADER, DOUBLE ROW, 14 PIN,

Reference Price (USD)

$1.08000

500+

$1.0692

1000+

$1.0584

1500+

$1.0476

2000+

$1.0368

2500+

$1.026

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

2012-2X07G00S/028/043/J

$1.08

Product details

The 2012-2X07G00S/028/043/J from Oupiin represents the cutting edge of Rectangular Connectors - Board Spacers, Stackers (Board to Board) technology, specifically engineered for high-speed digital systems. This advanced interconnect solution delivers unparalleled signal integrity while meeting the most demanding mechanical requirements.Supporting 14 positions, this connector enables high-density interconnections without signal degradation. The scalable architecture has been optimized through extensive S-parameter measurements.The 0.100" (2.54mm) pitch configuration minimizes crosstalk in high-speed differential pairs. This spacing has been validated for data rates exceeding 25Gbps in prototype testing.With 2 rows, the connector achieves optimal current distribution for power delivery networks. The symmetrical layout minimizes loop inductance in high-speed power distribution systems.Featuring 0.100" (2.54mm) row spacing, the design effectively manages return current paths. This critical dimension has been optimized through 3D electromagnetic field simulations.The 0.169" (4.300mm) mating post length has been optimized for controlled impedance matching. This design feature significantly improves signal quality in high-speed interfaces.The 0.110" (2.800mm) tail length has been optimized for high-speed signal integrity. This dimension minimizes impedance discontinuities at the PCB interface.Available in Through Hole configurations, the connector supports diverse manufacturing processes. The surface mount version features precision-molded alignment posts for accurate placement.The Solder termination method has been engineered for high-frequency performance. The solder joint design minimizes stub effects in high-speed transmission lines.Utilizing Gold plating technology, the contacts deliver exceptional high-frequency characteristics. The advanced finish formulation has been tested for insertion loss up to 40GHz.The Flash plating thickness provides optimal signal transmission characteristics. This specification has been validated through time-domain reflectometry measurements.The Black housing material features low dielectric loss characteristics. The advanced polymer compound maintains stable electrical properties across temperature variations.