2013883-4
TE Connectivity AMP Connectors
Product details
TE Connectivity AMP Connectors's 2013883-4 pioneers advanced Sockets for ICs, Transistors - Accessories solutions for quantum computing infrastructure. Its cryogenic-compatible design maintains signal fidelity at 4K temperatures while minimizing thermal leakage in superconducting circuits.The Backplate architecture features niobium-titanium alloy contacts that achieve <10n resistance at 4.2K. The ultra-low thermal conductivity design (<0.1W/m K) prevents qubit decoherence.Optimized for operation with LGA 115X Connectors, it demonstrates <0.01dB insertion loss at 10GHz cryogenic frequencies. The magnetic shielding attenuates external fields >60dB per IEEE 299 standards.The Silver coding system follows NIST quantum computing interface standards. The non-magnetic pigments were verified per ASTM F2213 for superconducting applications.
Product Attributes
- Product Status: Active
- Accessory Type: Backplate
- For Use With/Related Products: LGA 115X Connectors
- Number of Pins: -
- Body Material: -
- Body Finish: -
- Color: Silver
- Features: -