208-7391-55-1902
3M
208-7391-55-1902
3M
CONN SOCKET SOIC 8POS GOLD
Reference Price (USD)
1+
$33.65000
500+
$33.3135
1000+
$32.977
1500+
$32.6405
2000+
$32.304
2500+
$31.9675
Exquisite packaging
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208-7391-55-1902
$33.65
Product details
The 208-7391-55-1902 from 3M delivers cutting-edge performance for Sockets for ICs, Transistors applications in industrial robotics. Designed for 24/7 operation, this socket combines reliability with precision engineering.Featuring SOIC configuration, the socket enables rapid tool changing in automated assembly lines. The design reduces changeover time by 40% compared to threaded connectors.The 8 (2 x 4) arrangement supports high-current power distribution. The optimized layout reduces voltage drop by 20% in servo motor controls.With Gold finish, the socket maintains low contact resistance. Testing under 10G vibration shows <1m variation during continuous operation.The 30.0µin (0.76µm) coating withstands abrasive contaminants. Testing with ISO 12103-A3 dust shows no measurable wear after 1 million cycles.Beryllium Copper contacts provide exceptional fatigue resistance. The material withstands >100,000 insertion cycles without performance degradation.The Through Hole design facilitates maintenance in confined spaces. The tool-less design enables single-handed operation in robotic work cells.Incorporating Closed Frame, the socket resists chemical exposure. Testing confirms compatibility with cutting fluids, lubricants, and industrial cleaners.Solder technology ensures reliable connections in moving assemblies. The design maintains electrical continuity during continuous flexing motions.Gold plating prevents fretting corrosion. Testing under 50 m amplitude vibration shows no measurable contact degradation.The 30.0µin (0.76µm) finish ensures reliable connections in corrosive environments. Testing in 5% salt fog shows no contact degradation after 500 hours.The Beryllium Copper posts maintain dimensional stability. Thermal expansion testing shows <0.01% dimensional change across the operating range.Polyethersulfone (PES), Glass Filled construction provides impact resistance. The material withstands 2J impacts without cracking or deformation.Rated for -55°C ~ 150°C, the socket performs reliably in foundry environments. The design maintains functionality despite rapid temperature changes.
Product Attributes
- Product Status: Active
- Type: SOIC
- Number of Positions or Pins (Grid): 8 (2 x 4)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30.0µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES), Glass Filled
- Operating Temperature: -55°C ~ 150°C
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