21-460-001-010M

The 21-460-001-010M from Jones Tech represents a technological leap in Thermal - Adhesives, Epoxies, Greases, Pastes, specifically formulated for next-generation thermal management solutions. This high-performance material combines exceptional thermal transfer capabilities with outstanding reliability for mission-critical applications.This Liquid Gap Filler thermal interface material incorporates advanced polymer technology. Unlike conventional compounds, its viscoelastic properties adapt to thermal expansion differentials, maintaining optimal interface pressure throughout {Usable Temperature Range}.The 10cc Tube packaging options cater to diverse manufacturing needs. Precision-engineered containers ensure consistent material properties from first to last use, reducing application variability.Engineered for -40°F ~ 257°F (-40°C ~ 125°C) operation, this material demonstrates exceptional stability. Testing shows less than 3% thermal resistance variation after 1000 cycles, making it ideal for industrial automation systems.Gray coloration provides immediate visual confirmation of proper application. This quality assurance feature is particularly valuable in high-reliability applications where inspection access is limited.Delivering 6.00W/m-K thermal conductivity, this compound outperforms standard materials by 30-35%. Its optimized filler distribution creates efficient thermal pathways without compromising dielectric strength.The Low Outgassing (ASTM E595) formulation meets stringent requirements for military and aerospace applications. These specialized properties ensure reliable performance in extreme environmental conditions while preventing outgassing.With 6 Months shelf life, this product reduces material waste and inventory costs. Proper storage at {Storage/Refrigeration Temperature} maintains the compound's original performance characteristics.To preserve material integrity, maintain storage conditions at 77°F (25°C). This temperature control protocol prevents component separation and maintains optimal application properties.