2132529-3
TE Connectivity AMP Connectors
2132529-3
TE Connectivity AMP Connectors
IMP100S,H,V3P6C,LG,REW39,5.5
Reference Price (USD)
1+
$6.92738
500+
$6.8581062
1000+
$6.7888324
1500+
$6.7195586
2000+
$6.6502848
2500+
$6.581011
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
2132529-3
$6.93
Product details
TE Connectivity AMP Connectors's 2132529-3 redefines Backplane Connectors - Specialized technology for aerospace satellite payload systems. This space-grade connector solution combines radiation-hardened materials with ultra-high-frequency performance for next-generation communications satellites.Specifically engineered for Backplane applications, this series excels in GEO communications payloads.The Header, Male Pins interface configuration meets MIL-DTL-38999 Series III requirements while supporting Ka-band signal transmission.Featuring Impact, Guide Left technology, this series provides reliable RF performance in vacuum and thermal cycling environments.With 54 contact positions, the connector enables comprehensive payload subsystem integration in smallsat constellations.The All loaded configuration offers mass-optimized solutions for deployable satellite mechanisms.The 0.075" (1.90mm) spacing configuration maintains impedance control for high-speed digital interfaces in satellite processors.9 row design enables efficient packaging for modular satellite bus architectures.The 6 column arrangement supports high-speed data buses in Earth observation payloads.The Through Hole mounting system ensures mechanical stability during launch vehicle vibration profiles.The Press-Fit method has been qualified for wire-wrap reliability in zero-gravity conditions.The 36 Signal, 18 Ground arrangement provides optimal RF shielding while maintaining signal integrity in phased array antennas.Key Guide Pin include non-magnetic materials and outgassing-compliant designs for space applications.Gold plating technology exceeds ESA ECSS-Q-ST-70-08C requirements for space connector reliability.30.0µin (0.76µm) coating thickness ensures long-term performance in atomic oxygen environments.The Black housing material provides thermal emissivity properties optimized for spacecraft thermal management.
Product Attributes
- Product Status: Active
- Connector Usage: Backplane
- Connector Type: Header, Male Pins
- Connector Style: Impact, Guide Left
- Number of Positions: 54
- Number of Positions Loaded: All
- Pitch: 0.075" (1.90mm)
- Number of Rows: 9
- Number of Columns: 6
- Mounting Type: Through Hole
- Termination: Press-Fit
- Contact Layout, Typical: 36 Signal, 18 Ground
- Features: Guide Pin
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Color: Black
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