2134146-2
TE Connectivity AMP Connectors
2134146-2
TE Connectivity AMP Connectors
CONN SOCKET PGA 989POS GOLD
Reference Price (USD)
1+
$9.37000
500+
$9.2763
1000+
$9.1826
1500+
$9.0889
2000+
$8.9952
2500+
$8.9015
Exquisite packaging
Discount
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2134146-2
$9.37
Product details
The 2134146-2 from TE Connectivity AMP Connectors delivers laboratory-grade precision for Sockets for ICs, Transistors applications in test and measurement equipment. The ultra-stable design ensures <0.1% measurement uncertainty over 10,000 mating cycles.Featuring PGA configuration, the socket provides 10^14 insulation resistance. Guarded measurements confirm <1pA leakage current at 1000V for sensitive instrumentation.With 989 (35 x 36), the socket supports high-precision metrology. The symmetrical layout minimizes thermocouple effects to <0.1 V/ C.0.157" (4.00mm) spacing achieves optimal noise rejection. Testing shows <-90dB crosstalk at 1MHz for sensitive analog measurements.The Gold finish provides stable thermoelectric properties. Testing confirms <0.5 V contact potential variation over temperature.Flash thickness ensures long-term stability. Resistance measurements show <10ppm/year drift in controlled environments.Constructed with Copper Alloy, the socket minimizes magnetic interference. Testing shows <0.1 T field distortion at 1mm distance.The Surface Mount design prevents microphonic noise. Testing confirms <1 V vibration-induced noise in sensitive amplifier circuits.Incorporating Open Frame, the socket provides Faraday cage shielding. Testing shows >100dB RF isolation up to 10GHz for precision measurements.Solder technology ensures negligible insertion loss. Network analyzer measurements show <0.01dB loss at 6GHz for RF test applications.The 0.157" (4.00mm) spacing accommodates precision coaxial connections. Testing confirms <0.05mm positional accuracy for microwave probe stations.Tin-Lead plating prevents surface oxidation. XPS analysis shows <1nm oxide growth after 1000 hours in cleanroom environments.The Flash finish guarantees reproducible connections. Testing shows <0.01% contact resistance variation between mating cycles.The Copper Alloy posts maintain dimensional stability. Interferometer measurements show <10nm flatness variation over temperature.Thermoplastic housing material provides ultra-low outgassing. RGA testing shows <1 10^-9 Torr total mass loss for vacuum applications.
Product Attributes
- Product Status: Obsolete
- Type: PGA
- Number of Positions or Pins (Grid): 989 (35 x 36)
- Pitch - Mating: 0.157" (4.00mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: Flash
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.157" (4.00mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: Flash
- Contact Material - Post: Copper Alloy
- Housing Material: Thermoplastic
- Operating Temperature: -
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