2134440-1

The 2134440-1 by TE Connectivity AMP Connectors redefines excellence in Sockets for ICs, Transistors - Accessories for IoT edge computing devices. Engineered with adaptive impedance matching technology, this component ensures optimal signal propagation in smart city infrastructure and industrial sensor networks.Featuring Backplate topology, this solution achieves 60% reduction in power consumption compared to legacy designs. The auto-sensing contacts maintain <15m resistance across 0-100% humidity range per IEC 60529 IP68 standards.When paired with LGA 2011 Connectors, it demonstrates 25% faster data throughput in LoRaWAN applications. The patented contact geometry minimizes insertion loss (<0.3dB at 2.4GHz) for wireless module connections.Constructed from Steel, the housing exhibits <0.5% moisture absorption (per ASTM D570) and maintains mechanical stability through 1,000 thermal shock cycles (-40 C to +105 C).Nickel surface treatment provides <5 in roughness for consistent mating performance. The plating thickness (50 in min.) exceeds Telcordia GR-1217-CORE requirements for central office equipment.The Silver coding system follows ANSI/ISA-5.1 instrumentation standards for quick field identification. UV-resistant pigments withstand 10,000 hours of accelerated weathering per ASTM G154.