213900-2

The 213900-2 by TE Connectivity AMP Connectors represents a quantum leap in Circular Connectors - Accessories for quantum computing applications. This cryogenic-ready accessory maintains signal fidelity at temperatures approaching absolute zero while preventing thermal leakage in superconducting circuits.Functioning as Wire Entry Seal Kit, this revolutionary design exhibits less than 0.1dB insertion loss at 4K temperatures. Its non-metallic construction eliminates eddy current losses in high-field MRI environments.Optimized for CPC Plug and Receptacle Housing, the accessory demonstrates zero outgassing in ultra-high vacuum (10^-9 Torr) conditions. Materials selection follows NASA outgassing standards for space applications.Engineered to 17-10 specifications with 0.001 tolerance, the component prevents thermal shorts in multi-stage cryocooler systems. The nanoscale surface finish minimizes heat conduction through mechanical contacts.The cryogenic Silicon composite maintains dimensional stability across 300K to 4K thermal cycles. Material testing confirms no embrittlement after 1000 cycles between room temperature and liquid helium temperatures.Featuring Pressure Plate Included, this solution provides ultra-low thermal conductivity (<0.1 W/mK) while maintaining 100Gbps data transmission. Its monolithic construction eliminates differential contraction issues in cryogenic environments.The Red options incorporate low-emissivity coatings to minimize radiative heat transfer. Special finishes reduce infrared signature in sensitive detector applications.