216-7224-55-1902
3M
216-7224-55-1902
3M
CONN SOCKET SOIC 16POS GOLD
Reference Price (USD)
1+
$37.45000
500+
$37.0755
1000+
$36.701
1500+
$36.3265
2000+
$35.952
2500+
$35.5775
Exquisite packaging
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216-7224-55-1902
$37.45
Product details
The 216-7224-55-1902 from 3M delivers laboratory-grade precision for Sockets for ICs, Transistors applications in test and measurement equipment. The ultra-stable design ensures <0.1% measurement uncertainty over 10,000 mating cycles.Featuring SOIC configuration, the socket provides 10^14 insulation resistance. Guarded measurements confirm <1pA leakage current at 1000V for sensitive instrumentation.With 16 (2 x 8), the socket supports high-precision metrology. The symmetrical layout minimizes thermocouple effects to <0.1 V/ C.The Gold finish provides stable thermoelectric properties. Testing confirms <0.5 V contact potential variation over temperature.Constructed with Beryllium Copper, the socket minimizes magnetic interference. Testing shows <0.1 T field distortion at 1mm distance.The Through Hole design prevents microphonic noise. Testing confirms <1 V vibration-induced noise in sensitive amplifier circuits.Incorporating Closed Frame, the socket provides Faraday cage shielding. Testing shows >100dB RF isolation up to 10GHz for precision measurements.Solder technology ensures negligible insertion loss. Network analyzer measurements show <0.01dB loss at 6GHz for RF test applications.Gold plating prevents surface oxidation. XPS analysis shows <1nm oxide growth after 1000 hours in cleanroom environments.The 30.0µin (0.76µm) finish guarantees reproducible connections. Testing shows <0.01% contact resistance variation between mating cycles.The Beryllium Copper posts maintain dimensional stability. Interferometer measurements show <10nm flatness variation over temperature.Polyethersulfone (PES), Glass Filled housing material provides ultra-low outgassing. RGA testing shows <1 10^-9 Torr total mass loss for vacuum applications.Rated for -55°C ~ 150°C, the socket ensures measurement stability. Testing confirms <1ppm/ C thermal EMF variation across the range.
Product Attributes
- Product Status: Active
- Type: SOIC
- Number of Positions or Pins (Grid): 16 (2 x 8)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30.0µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES), Glass Filled
- Operating Temperature: -55°C ~ 150°C
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