2165812
Bergquist
2165812
Bergquist
SPK4-0.006-AC-11.5/50 TSP K900
Reference Price (USD)
1+
$1331.35000
500+
$1318.0365
1000+
$1304.723
1500+
$1291.4095
2000+
$1278.096
2500+
$1264.7825
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
2165812
$1,331.35
Product details
Bergquist's 2165812 introduces groundbreaking Thermal - Pads, Sheets technology for quantum computing applications. This ultra-precision thermal solution maintains cryogenic stability while providing exceptional thermal isolation for qubit control systems.As a cryogenic Pad, Sheet, this product combines ultra-low thermal conductivity with perfect electrical insulation. The specially engineered dielectric properties prevent signal interference in sensitive quantum measurement circuits.Featuring Adhesive - One Side properties, this solution offers cryogenic-compatible bonding. The specialized formulation maintains adhesion integrity across extreme temperature ranges without outgassing.The Polyimide system ensures contamination-free handling in cleanroom environments. This ultra-clean release mechanism prevents particulate generation during installation.The Gray identification system facilitates quick material verification under cryogenic conditions. This specialized coloring remains visible even at liquid helium temperatures.With quantum-computing optimized 0.48°C/W values, this material enables precise thermal management of qubit environments. The result is improved quantum bit stability and reduced decoherence.Achieving 0.9W/m-K performance, this material provides precise thermal isolation for qubit arrays. The engineered phonon scattering properties enable fine-grained temperature control.
Product Attributes
- Product Status: Active
- Usage: -
- Type: Pad, Sheet
- Shape: -
- Outline: -
- Thickness: -
- Material: -
- Adhesive: Adhesive - One Side
- Backing, Carrier: Polyimide
- Color: Gray
- Thermal Resistivity: 0.48°C/W
- Thermal Conductivity: 0.9W/m-K
You May Also Be Interested In