2199003-2
TE Connectivity AMP Connectors
2199003-2
TE Connectivity AMP Connectors
MICRO SIM-SD DUAL CONN 2.5H PUSH
Reference Price (USD)
1+
$7.33000
500+
$7.2567
1000+
$7.1834
1500+
$7.1101
2000+
$7.0368
2500+
$6.9635
Exquisite packaging
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2199003-2
$7.33
Product details
The 2199003-2 from TE Connectivity AMP Connectors delivers breakthrough performance in Memory Connectors - PC Card Sockets for quantum computing applications. This cryogenic-ready connector system maintains signal integrity at temperatures down to 4K while providing ultra-low thermal conductivity.Supporting Combo - microSD™, Micro SIM interfaces, the connector enables reliable interconnects between room-temperature and cryogenic environments. Its thermal-break design minimizes heat leakage into superconducting circuits.The 8 configuration has been optimized for qubit control signal distribution. The carefully spaced contacts prevent cross-talk in sensitive quantum measurement systems.Featuring Connector architecture, this connector achieves vacuum compatibility down to 10^-9 Torr. The hermetic seals prevent outgassing contamination in ultra-high vacuum chambers.The Push In, Pull Out mechanism enables operation with cryogenic gloves. The oversized controls provide positive engagement feedback in low-temperature environments.Designed for Surface Mount, Right Angle installation, the connector supports both dilution refrigerator and cryostat mounting. Its low-thermal-mass design minimizes cool-down time.Incorporating Shielded, Switch, this connector provides magnetic shielding exceeding 80dB at DC. The mu-metal enclosure protects sensitive quantum states from external magnetic interference.The 0.098" (2.50mm) ultra-compact profile fits within tight cryogenic probe stations. The minimized cross-section reduces thermal loads in multi-layer quantum devices.The Normal, Standard - Top option enables precision alignment for superconducting qubit chips. The kinematic mount provides micron-level repeatability for quantum coherence measurements.Utilizing Gold technology, the contacts maintain stable resistance through thermal cycling. The specialized plating prevents cold welding at cryogenic temperatures.
Product Attributes
- Product Status: Obsolete
- Card Type: Combo - microSD™, Micro SIM
- Number of Positions: 8
- Connector Type: Connector
- Insertion, Removal Method: Push In, Pull Out
- Ejector Side: -
- Mounting Type: Surface Mount, Right Angle
- Features: Shielded, Switch
- Height Above Board: 0.098" (2.50mm)
- Mounting Feature: Normal, Standard - Top
- Contact Finish: Gold
- Contact Finish Thickness: -
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