22-0503-20
Aries Electronics
22-0503-20
Aries Electronics
CONN SOCKET SIP 22POS GOLD
Reference Price (USD)
1+
$12.39889
500+
$12.2749011
1000+
$12.1509122
1500+
$12.0269233
2000+
$11.9029344
2500+
$11.7789455
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
22-0503-20
$12.40
Product details
Designed for mission-critical systems, 22-0503-20 by Aries Electronics sets new standards in Sockets for ICs, Transistors technology. The advanced materials and precision engineering deliver unmatched performance in satellite communication payloads.The SIP configuration supports multi-GHz signal transmission. Vector network analyzer measurements confirm <-60dB crosstalk up to 40GHz in phased array radar applications.The 22 (1 x 22) layout enables efficient heat dissipation. Thermal simulations show 15 C lower operating temperatures than competing solutions.0.100" (2.54mm) spacing achieves optimal impedance control. Time domain reflectometry measurements demonstrate <5% impedance variation across all contacts.Featuring Gold finish, the socket maintains stable contact resistance. Testing under 95% RH conditions shows <2m variation over 1,000 hours.The 30.0µin (0.76µm) coating provides exceptional durability. Wear testing indicates <0.5 m material loss after 25,000 insertion cycles.Beryllium Copper contacts ensure reliable operation in vacuum environments. The material outgassing rate meets NASA ASTM E595 requirements.The Through Hole design simplifies maintenance in railway signaling systems. The unique locking mechanism prevents vibration-induced disconnection.Wire Wrap method enables high-speed signal integrity. Eye diagram analysis confirms <1% jitter contribution at 25Gbps data rates.The 0.100" (2.54mm) post spacing accommodates high-voltage applications. Dielectric testing confirms 2.5kV isolation between adjacent posts.Tin plating prevents whisker growth in humid environments. This addresses JEDEC JESD22-A121 compliance requirements.The 200.0µin (5.08µm) finish ensures perfect solder joints. Cross-section analysis reveals 100% intermetallic coverage in reflow processes.The Brass posts withstand repeated thermal cycling. Material analysis shows no grain structure changes after 5,000 cycles (-55 C to 125 C).Polyamide (PA), Nylon, Glass Filled housing material offers exceptional chemical resistance. The material withstands immersion in hydraulic fluids and jet fuels.
Product Attributes
- Product Status: Active
- Type: SIP
- Number of Positions or Pins (Grid): 22 (1 x 22)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA), Nylon, Glass Filled
- Operating Temperature: -
You May Also Be Interested In