220-7201-55-1902
3M
220-7201-55-1902
3M
CONN SOCKET SOIC 20POS GOLD
Reference Price (USD)
1+
$42.46000
500+
$42.0354
1000+
$41.6108
1500+
$41.1862
2000+
$40.7616
2500+
$40.337
Exquisite packaging
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220-7201-55-1902
$42.46
Product details
3M's 220-7201-55-1902 sets new benchmarks for Sockets for ICs, Transistors components in renewable energy systems. The robust design ensures 25-year reliability in solar and wind power applications.The SOIC architecture provides lightning surge protection. Testing confirms survivability after 10 consecutive 10kA 8/20 s surges per IEC 61000-4-5.With 20 (2 x 10), the socket enables high-current power conversion. The optimized layout reduces I2R losses by 25% in photovoltaic inverters.Featuring Gold finish, the socket resists sulfur corrosion. Testing in H2S environments shows no degradation after 1000 hours.Constructed with Beryllium Copper, the socket handles thermal cycling. Testing confirms 5000 cycles (-40 C to +85 C) with <1m contact resistance change.The Through Hole design resists wind-induced vibration. Testing confirms no loosening after 10^7 cycles at 0.5mm amplitude.Incorporating Closed Frame, the socket prevents PID (Potential Induced Degradation). Testing shows <1% power loss in 1000V biased damp heat conditions.Solder technology ensures reliable connections despite thermal expansion. Testing confirms <0.1mm movement during 100 C temperature swings.Gold plating prevents fretting in vibrating environments. Testing shows <2m change after 10^8 micro-motions.The 30.0µin (0.76µm) finish ensures reliable connections despite thermal cycling. Testing shows no degradation after 1000 -40 C/+105 C cycles.The Beryllium Copper posts resist stress relaxation. Testing confirms <3% contact force loss after 25 years at 70 C.Polyethersulfone (PES), Glass Filled housing material provides tracking resistance. The material achieves CTI 600 for high-pollution environments.Rated for -55°C ~ 150°C, the socket performs in extreme weather. Testing confirms operation from -40 C to +105 C with 95% RH.
Product Attributes
- Product Status: Active
- Type: SOIC
- Number of Positions or Pins (Grid): 20 (2 x 10)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30.0µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES), Glass Filled
- Operating Temperature: -55°C ~ 150°C
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