2229490-3
TE Connectivity AMP Connectors
2229490-3
TE Connectivity AMP Connectors
CONN SOCKET PGA ZIF 947POS GOLD
Reference Price (USD)
1+
$10.00000
500+
$9.9
1000+
$9.8
1500+
$9.7
2000+
$9.6
2500+
$9.5
Exquisite packaging
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2229490-3
$10.00
Product details
Designed for mission-critical systems, 2229490-3 by TE Connectivity AMP Connectors sets new standards in Sockets for ICs, Transistors technology. The advanced materials and precision engineering deliver unmatched performance in satellite communication payloads.The PGA, ZIF (ZIP) configuration supports multi-GHz signal transmission. Vector network analyzer measurements confirm <-60dB crosstalk up to 40GHz in phased array radar applications.The 947 (35 x 36) layout enables efficient heat dissipation. Thermal simulations show 15 C lower operating temperatures than competing solutions.0.039" (1.00mm) spacing achieves optimal impedance control. Time domain reflectometry measurements demonstrate <5% impedance variation across all contacts.Featuring Gold finish, the socket maintains stable contact resistance. Testing under 95% RH conditions shows <2m variation over 1,000 hours.The 15.0µin (0.38µm) coating provides exceptional durability. Wear testing indicates <0.5 m material loss after 25,000 insertion cycles.Copper Alloy contacts ensure reliable operation in vacuum environments. The material outgassing rate meets NASA ASTM E595 requirements.The Surface Mount design simplifies maintenance in railway signaling systems. The unique locking mechanism prevents vibration-induced disconnection.With Open Frame, the socket achieves EMI shielding effectiveness >60dB. This meets MIL-STD-461G requirements for sensitive military electronics.Solder method enables high-speed signal integrity. Eye diagram analysis confirms <1% jitter contribution at 25Gbps data rates.The 0.039" (1.00mm) post spacing accommodates high-voltage applications. Dielectric testing confirms 2.5kV isolation between adjacent posts.Tin-Lead plating prevents whisker growth in humid environments. This addresses JEDEC JESD22-A121 compliance requirements.The 15.0µin (0.38µm) finish ensures perfect solder joints. Cross-section analysis reveals 100% intermetallic coverage in reflow processes.The Copper Alloy posts withstand repeated thermal cycling. Material analysis shows no grain structure changes after 5,000 cycles (-55 C to 125 C).Thermoplastic housing material offers exceptional chemical resistance. The material withstands immersion in hydraulic fluids and jet fuels.
Product Attributes
- Product Status: Active
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): 947 (35 x 36)
- Pitch - Mating: 0.039" (1.00mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15.0µin (0.38µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.039" (1.00mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 15.0µin (0.38µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Thermoplastic
- Operating Temperature: -
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