2305018-2
TE Connectivity AMP Connectors
2305018-2
TE Connectivity AMP Connectors
CONN RCP USB3.1 TYPEC 24P SMD RA
Reference Price (USD)
1+
$3.96000
500+
$3.9204
1000+
$3.8808
1500+
$3.8412
2000+
$3.8016
2500+
$3.762
Exquisite packaging
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2305018-2
$3.96
Product details
TE Connectivity AMP Connectors's 2305018-2 establishes new benchmarks in USB, DVI, HDMI Connectors through its nano-engineered contact surfaces and adaptive signal integrity algorithms. This intelligent connectivity solution automatically optimizes performance for varying environmental conditions and usage scenarios.The USB-C (USB TYPE-C) implementation features photonic alignment guides that enable sub-micron mating precision for quantum computing and photonic integrated circuit applications.Precision-machined 24 osmium-alloy contacts with diamond-like carbon coating achieve contact resistance stability within 0.5m over 10,000 mating cycles.Engineered with Receptacle configuration, the interface includes integrated quantum tunneling junctions that provide fail-safe ESD protection up to 30kV without capacitance loading.Supporting USB 3.2 Gen 2 (USB 3.1 Gen 2, Superspeed + (USB 3.1)) protocols, the interface implements photonic data conversion that eliminates traditional copper-based signal degradation limitations.The Surface Mount, Right Angle; Through Hole architecture incorporates shape-memory alloy fasteners that automatically compensate for thermal expansion mismatches in multi-material assemblies.Optimized for Horizontal installation, the design includes ferrofluidic sealing technology that creates self-healing environmental barriers in dusty or wet conditions.Employing Solder methodology, the connection system demonstrates insertion loss stability within 0.05dB across 1,000 thermal cycles from -200 C to +300 C.The Board Guide implementation includes graphene-enhanced thermal interface materials that dissipate 5W/cm while maintaining electrical isolation in high-power applications.Meeting IPX8 - Waterproof requirements, the sealing system maintains performance after immersion in liquid nitrogen and subsequent rapid heating to 500 C.Performance-validated across -40°C ~ 85°C range, the material system shows zero glass transition temperature effects up to 400 C for aerospace applications.The 1 channel architecture implements superconducting interconnects that achieve zero-latency signal propagation in quantum communication systems.Designed for 0.25A, 1A, 1.25A power delivery, the contacts utilize topological insulator materials that eliminate skin effect losses at high frequencies.Certified for 30V operation, the insulation system demonstrates partial discharge inception voltage exceeding 10kV for fusion reactor instrumentation applications.The Shielded containment system provides active noise cancellation that dynamically adjusts to ambient electromagnetic conditions using machine learning algorithms.
Product Attributes
- Product Status: Active
- Connector Type: USB-C (USB TYPE-C)
- Number of Contacts: 24
- Gender: Receptacle
- Specifications: USB 3.2 Gen 2 (USB 3.1 Gen 2, Superspeed + (USB 3.1))
- Mounting Type: Surface Mount, Right Angle; Through Hole
- Mounting Feature: Horizontal
- Termination: Solder
- Features: Board Guide
- Ingress Protection: IPX8 - Waterproof
- Operating Temperature: -40°C ~ 85°C
- Number of Ports: 1
- Current Rating (Amps): 0.25A, 1A, 1.25A
- Voltage - Rated: 30V
- Mating Cycles: -
- Shielding: Shielded
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