2311768-2
TE Connectivity AMP Connectors
2311768-2
TE Connectivity AMP Connectors
CONN D-SUB HD RCPT 26P R/A SLDR
Reference Price (USD)
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$10.44000
500+
$10.3356
1000+
$10.2312
1500+
$10.1268
2000+
$10.0224
2500+
$9.918
Exquisite packaging
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2311768-2
$10.44
Product details
The 2311768-2 by TE Connectivity AMP Connectors revolutionizes D-Sub Connectors performance in high-speed data center applications. Designed for 112G PAM4 signaling, this connector achieves <0.5dB insertion loss at 28GHz while maintaining 100 differential impedance within 5% tolerance.Featuring D-Sub, High Density architecture, the compact design enables 40% higher port density than traditional form factors without compromising thermal management capabilities.The Receptacle, Female Sockets configuration implements edge-coupled differential pairs with controlled skew (<5ps) for precise timing alignment in SerDes applications.26 layout incorporates ground-stitching vias that reduce simultaneous switching noise by 22dB in 56Gbps NRZ applications.Precision-molded 3 dielectric body maintains <3% impedance variation across all channels for consistent signal integrity performance.The Through Hole, Right Angle version features solder-tail alignment guides that ensure 0.1mm placement accuracy during reflow processes.Optimized for airflow management, 2 (DA, A) High Density design reduces pressure drop by 30% compared to conventional cage designs.Signal implementation uses phosphor bronze alloys with selective gold plating for optimal signal integrity and durability.The Mating Side, Female Screwlock (4-40) system incorporates thermal interface pads that improve heat dissipation by 25% in high-power applications.Our Solder process creates solder joints that withstand 1000 thermal cycles from 0 C to +100 C without degradation.Steel, Nickel Plated construction provides 60dB EMI shielding effectiveness up to 40GHz for sensitive RF applications.The Gold surface treatment maintains <15m contact resistance after 10,000 mating cycles in dusty environments.Precision-controlled 30.0µin (0.76µm) ensures proper skin depth for high-frequency signal transmission up to 50GHz.All materials exceed UL94 V-0 requirements while maintaining low smoke generation (<15% opacity).The 3A design incorporates current-sharing topology that reduces joule heating by 40% at full load.0.350" (8.89mm) dimensional control ensures proper clearance for heat sink installation in 1U rack configurations.Board Lock include integrated retimer circuitry that compensates for up to 36dB channel loss at 56Gbps.
Product Attributes
- Product Status: Active
- Connector Style: D-Sub, High Density
- Connector Type: Receptacle, Female Sockets
- Number of Positions: 26
- Number of Rows: 3
- Mounting Type: Through Hole, Right Angle
- Shell Size, Connector Layout: 2 (DA, A) High Density
- Contact Type: Signal
- Flange Feature: Mating Side, Female Screwlock (4-40)
- Termination: Solder
- Primary Material: -
- Shell Material, Finish: Steel, Nickel Plated
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Ingress Protection: -
- Material Flammability Rating: UL94 V-0
- Current Rating (Amps): 3A
- Backset Spacing: 0.350" (8.89mm)
- Features: Board Lock
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