2332772-1
TE Connectivity AMP Connectors
Product details
TE Connectivity AMP Connectors's 2332772-1 revolutionizes Coaxial Connectors (RF) - Contacts technology for high-performance computing infrastructure. This ultra-high-speed contact solution delivers unprecedented signal integrity for AI server clusters and data center interconnect applications.Compatible with RG-405 (.086 Semi Rigid) specifications for hyperscale data centers. The OM5 MMF compatibility supports 400G-SR8 implementations.The Crimp methodology achieves <0.5ps skew in differential pairs. The press-fit design maintains impedance control for 56Gbps NRZ signaling.HPC-optimized Pin geometry minimizes crosstalk in dense configurations. The shielded twinax design provides >40dB isolation at 28GHz.The Free Hanging (In-Line) options support high-density server architectures. Mid-board configurations enable direct ASIC-to-ASIC connections.Precision-matched 50Ohm characteristics are critical for SerDes performance. The 85Ohm differential version is optimized for PCIe 5.0 implementations.HPC-grade Copper Alloy includes low-loss dielectric composites. Liquid crystal polymer insulation minimizes dielectric absorption.The Gold layer formulation reduces skin effect losses. 15 m gold over 50 m nickel plating ensures <0.3dB/inch loss at 50GHz.HPC-optimized 50.0µin (1.27µm) balances performance and cost. The selective 30.0 in (0.76 m) gold plating meets 25Gbps+ requirements.
Product Attributes
- Product Status: Active
- Cable Group: RG-405 (.086 Semi Rigid)
- Center Conductor Diameter: -
- Wire Gauge: -
- Contact Termination: Crimp
- Pin or Socket: Pin
- Type: -
- Mounting Type: Free Hanging (In-Line)
- Impedance: 50Ohm
- Contact Material: Copper Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 50.0µin (1.27µm)
- Features: -
- Board Thickness: -