24-6554-11
Aries Electronics
24-6554-11
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS GLD
Reference Price (USD)
1+
$19.43000
500+
$19.2357
1000+
$19.0414
1500+
$18.8471
2000+
$18.6528
2500+
$18.4585
Exquisite packaging
Discount
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24-6554-11
$19.43
Product details
The 24-6554-11 from Aries Electronics delivers military-grade performance for Sockets for ICs, Transistors applications in defense systems. Designed to exceed MIL-STD-883 requirements, this socket ensures mission success in extreme conditions.Featuring DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing configuration, the socket provides EMP protection for sensitive electronics. Testing confirms survivability in 50kV/m transient electromagnetic fields.With 24 (2 x 12), the socket supports ruggedized avionics designs. The reinforced grid pattern withstands 100G mechanical shock per MIL-STD-810H.0.100" (2.54mm) spacing maintains signal integrity in jamming environments. Testing shows <-65dB crosstalk despite intentional RF interference.The Gold finish resists corrosion in salt fog. Testing per MIL-STD-202G Method 101 shows no degradation after 1000 hours.Constructed with Beryllium Copper, the socket withstands ballistic impacts. Testing confirms functionality after 30g 11ms half-sine shock pulses.The Through Hole design prevents loosening in vibration. Testing per MIL-STD-167-1 shows zero connection loss at 29Hz-2kHz random vibration.Incorporating Closed Frame, the socket provides NBC (Nuclear, Biological, Chemical) protection. Sealing tests confirm operation after immersion in decontamination solutions.Solder technology ensures reliability in high-altitude conditions. Testing confirms operation at 70,000 feet with <1% contact resistance change.The 0.100" (2.54mm) spacing accommodates armored cable terminations. Mechanical testing confirms 500N pull-out resistance for field-replaceable connections.Gold plating prevents galvanic corrosion. Testing in marine environments shows no measurable degradation after 5 years.The Beryllium Copper posts resist stress corrosion cracking. Testing per ASTM G36 shows no cracking after 1000 hours in boiling MgCl2.Polyphenylene Sulfide (PPS), Glass Filled housing material provides radar absorption. Testing shows -20dB RCS reduction compared to metal housings.
Product Attributes
- Product Status: Active
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 24 (2 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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