2678610
Bergquist
2678610
Bergquist
TGP12000ULM-0.125-00-0808
Reference Price (USD)
1+
$725.28500
500+
$718.03215
1000+
$710.7793
1500+
$703.52645
2000+
$696.2736
2500+
$689.02075
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
2678610
$725.28
Product details
The 2678610 from Bergquist delivers military-grade Thermal - Pads, Sheets solutions for harsh environment electronics. This extreme-duty thermal interface material meets MIL-STD-810 requirements while providing reliable thermal management for defense and aerospace systems.As a MIL-spec Gap Filler Pad, Sheet, this product combines extreme temperature stability with vibration resistance. The specially formulated matrix withstands 50G mechanical shock while maintaining perfect thermal contact.Precision-manufactured in Square configurations, this material meets tight military tolerances. The laser-cut edges ensure perfect fitment in ruggedized enclosures with strict dimensional requirements.With 203.20mm x 203.20mm dimensions, this solution accommodates standard military electronic packaging. The size-optimized design allows for efficient thermal management in space-constrained armored vehicles and aircraft systems.Featuring ultra-tight 0.125" (3.18mm) tolerances ( 0.01mm), this material ensures reliable interface contact under vibration. The controlled compression characteristics maintain optimal thermal transfer in dynamic environments.Formulated with mil-spec Silicone, this pad exhibits exceptional resistance to fuels and hydraulic fluids. This property ensures long-term reliability in engine compartments and weapons systems.Featuring Tacky - Both Sides properties, this solution offers instant bonding in field repair situations. The high-tack formulation ensures immediate attachment even in dusty or oily conditions.The Gray coding system complies with military identification standards. This standardized coloring facilitates quick material verification during field maintenance operations.Delivering 12W/m-K performance, this material enables effective cooling in armored electronics. The anisotropic properties provide directional heat flow for targeted cooling of high-power components.
Product Attributes
- Product Status: Active
- Usage: -
- Type: Gap Filler Pad, Sheet
- Shape: Square
- Outline: 203.20mm x 203.20mm
- Thickness: 0.125" (3.18mm)
- Material: Silicone
- Adhesive: Tacky - Both Sides
- Backing, Carrier: -
- Color: Gray
- Thermal Resistivity: -
- Thermal Conductivity: 12W/m-K
You May Also Be Interested In