2701-3-01-01-00-00-07-0
Mill-Max Manufacturing Corp.
2701-3-01-01-00-00-07-0
Mill-Max Manufacturing Corp.
CONN PC PIN CIRC .156DIA TINLEAD
Reference Price (USD)
1+
$0.66401
500+
$0.6573699
1000+
$0.6507298
1500+
$0.6440897
2000+
$0.6374496
2500+
$0.6308095
Exquisite packaging
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2701-3-01-01-00-00-07-0
$0.66
Product details
Mill-Max Manufacturing Corp.'s 2701-3-01-01-00-00-07-0 establishes new benchmarks in Terminals - PC Pin, Single Post Connectors performance for terahertz communication systems. This breakthrough solution enables unprecedented data rates while maintaining impeccable signal integrity across millimeter-wave spectra.The PC Pin design incorporates plasmonic waveguides that minimize dispersion losses above 300GHz operation frequencies.Implementing Single End, Slotted topology, the terminal achieves 0.01dB insertion loss at 1THz, surpassing conventional RF connector performance.Precision-engineered 0.156" (3.96mm) Dia dimensions maintain 50 characteristic impedance across ultra-wideband frequencies.The 0.112" (2.84mm) Dia geometry prevents mode conversion in waveguide-to-chip transitions.The 0.312" (7.92mm) exposed conductor length is tuned to prevent standing wave formation in sub-mm wave applications.Optimized 0.135" (3.43mm) dimension creates perfect impedance matching in on-chip antennas.With 0.447" (11.35mm) /100 profile, the terminal enables true quasi-optical coupling in terahertz imaging systems.The 0.156" (3.96mm) incorporates photonic bandgap structures that suppress surface wave propagation.Sub-micron 0.116" (2.95mm) precision ensures proper alignment in heterodyne receiver arrays.The Through Hole configuration supports flip-chip bonding techniques for integrated photonic-electronic systems.Swage, Knurled technology provides quantum-limited noise performance in molecular spectroscopy applications.Non-Insulated material demonstrates negligible dielectric absorption across the entire terahertz gap.Compatible with 0.094" (2.39mm) fused quartz substrates used in terahertz integrated circuits.Selected Brass Alloy exhibits exceptional electron mobility for ballistic transport in nanoscale contacts.The Tin-Lead surface treatment prevents anomalous skin effect at terahertz frequencies.Precisely controlled 200.0µin (5.08µm) maintains constant surface impedance across temperature variations.
Product Attributes
- Product Status: Active
- Terminal Type: PC Pin
- Terminal Style: Single End, Slotted
- Pin Size - Above Flange: 0.156" (3.96mm) Dia
- Pin Size - Below Flange: 0.112" (2.84mm) Dia
- Length - Above Flange: 0.312" (7.92mm)
- Length - Below Flange: 0.135" (3.43mm)
- Length - Overall: 0.447" (11.35mm)
- Flange Diameter: 0.156" (3.96mm)
- Mounting Hole Diameter: 0.116" (2.95mm)
- Mounting Type: Through Hole
- Termination: Swage, Knurled
- Insulation: Non-Insulated
- Board Thickness: 0.094" (2.39mm)
- Contact Material: Brass Alloy
- Contact Finish: Tin-Lead
- Contact Finish Thickness: 200.0µin (5.08µm)
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