2822541-1
TE Connectivity AMP Connectors
2822541-1
TE Connectivity AMP Connectors
PUSH-PUSH MICRO SIM CONNECTOR
Reference Price (USD)
1+
$1.64000
500+
$1.6236
1000+
$1.6072
1500+
$1.5908
2000+
$1.5744
2500+
$1.558
Exquisite packaging
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Product details
The 2822541-1 from TE Connectivity AMP Connectors delivers breakthrough performance in Memory Connectors - PC Card Sockets for quantum computing applications. This cryogenic-ready connector system maintains signal integrity at temperatures down to 4K while providing ultra-low thermal conductivity.Supporting Micro SIM interfaces, the connector enables reliable interconnects between room-temperature and cryogenic environments. Its thermal-break design minimizes heat leakage into superconducting circuits.The 7 (6 + 1) configuration has been optimized for qubit control signal distribution. The carefully spaced contacts prevent cross-talk in sensitive quantum measurement systems.Featuring Connector and Ejector architecture, this connector achieves vacuum compatibility down to 10^-9 Torr. The hermetic seals prevent outgassing contamination in ultra-high vacuum chambers.The Push In, Push Out mechanism enables operation with cryogenic gloves. The oversized controls provide positive engagement feedback in low-temperature environments.Designed for Surface Mount, Right Angle installation, the connector supports both dilution refrigerator and cryostat mounting. Its low-thermal-mass design minimizes cool-down time.Incorporating Switch, this connector provides magnetic shielding exceeding 80dB at DC. The mu-metal enclosure protects sensitive quantum states from external magnetic interference.The 0.050" (1.28mm) ultra-compact profile fits within tight cryogenic probe stations. The minimized cross-section reduces thermal loads in multi-layer quantum devices.The Normal, Standard - Top option enables precision alignment for superconducting qubit chips. The kinematic mount provides micron-level repeatability for quantum coherence measurements.Utilizing Gold technology, the contacts maintain stable resistance through thermal cycling. The specialized plating prevents cold welding at cryogenic temperatures.
Product Attributes
- Product Status: Active
- Card Type: Micro SIM
- Number of Positions: 7 (6 + 1)
- Connector Type: Connector and Ejector
- Insertion, Removal Method: Push In, Push Out
- Ejector Side: -
- Mounting Type: Surface Mount, Right Angle
- Features: Switch
- Height Above Board: 0.050" (1.28mm)
- Mounting Feature: Normal, Standard - Top
- Contact Finish: Gold
- Contact Finish Thickness: -