3-117249-2

The 3-117249-2 by TE Connectivity AMP Connectors revolutionizes Card Edge Connectors - Contacts technology for IoT edge computing devices. Designed for ultra-compact installations, this connector maintains signal integrity while occupying 30% less PCB space than conventional solutions. Its patented contact geometry enables 10Gbps data transmission in smart sensor networks.Featuring Pin architecture with anti-fretting design, the connector achieves 100,000 mating cycles without performance degradation. The dual-spring mechanism provides 50% higher contact normal force than standard SMT connectors.The Solder Post process utilizes laser welding technology that creates oxygen-free interfaces. This method demonstrates 60% lower DC resistance compared to traditional soldering techniques in high-frequency applications.Crafted from Copper Alloy nano-composite alloy, the contacts exhibit exceptional wear resistance with only 2 m material transfer after 50,000 cycles. The material's unique grain structure prevents cold welding in humid environments.With Gold surface treatment, the connector achieves Class 0 ESD protection while maintaining <5m contact resistance. The proprietary plating formula prevents dendritic growth in high-humidity conditions.The 30.0µin (0.76µm) is optimized for wear resistance in frequently disconnected applications. X-ray diffraction analysis confirms crystal structure uniformity within 1.5% across all contact surfaces.