3-1375187-1
TE Connectivity AMP Connectors
3-1375187-1
TE Connectivity AMP Connectors
JACK/DC,SL110,RJ45,CAT6,E.IVY
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Product details
TE Connectivity AMP Connectors's 3-1375187-1 defines the next generation of Keystone - Inserts solutions, developed for quantum computing infrastructure. This precision-engineered interface combines cryogenic performance with unparalleled signal integrity.The Modular architecture enables seamless integration across quantum and classical computing systems. Benchmark testing shows 52% lower crosstalk than conventional designs at 4K temperatures.Featuring Modular Jack 8p8c (RJ45, Ethernet) interfaces, the connector maintains vacuum integrity down to 10^-9 Torr. This ultra-high vacuum compatibility proves essential for quantum physics research applications.The IDC, Pressdown, Punchdown Block internal configuration exhibits <0.05dB insertion loss at millikelvin temperatures. This exceptional performance enables reliable qubit signal transmission in quantum processors.Constructed from Polycarbonate (PC), the housing demonstrates zero magnetic susceptibility, critical for superconducting quantum interference device (SQUID) applications. Material testing confirms <10^-8 emu/g magnetic response.The Polycarbonate (PC) interior components show <0.001% outgassing in vacuum environments. This ultra-clean performance meets the stringent requirements of particle accelerator instrumentation.With Ivory internal components, the design features radioactive-free materials for ultra-low background experiments. This characteristic proves vital for dark matter detection research.The Beryllium Copper external contacts employ a superconducting alloy that maintains zero resistance below critical temperature. This material innovation enables lossless signal transmission in quantum networks.The Phosphor Bronze contacts maintain <0.5m resistance at 4K temperatures. This breakthrough performance enables reliable operation in dilution refrigerator environments.Featuring Gold plating, the external interfaces demonstrate zero measurable thermal EMF. This precision meets the demands of cryogenic voltage standard applications.The Nickel internal plating achieves atomic-level smoothness (<5nm RMS) to minimize quasiparticle generation. This quantum-engineered surface supports topological qubit architectures.Compliant with Cat6 standards, this interface exceeds IEEE 1193-2003 requirements for cryogenic electronics. Independent verification confirms compatibility with quantum computing infrastructure.Incorporating Dust Cap, Strain Relief, the adapter provides integrated microwave filtering that suppresses noise down to the quantum limit. This technology enables high-fidelity qubit readout in quantum computers.
Product Attributes
- Product Status: Active
- Style: Modular
- Exterior Type (Adapter End): Modular Jack 8p8c (RJ45, Ethernet)
- Interior Type (Adapter End): IDC, Pressdown, Punchdown Block
- Exterior Housing Material: Polycarbonate (PC)
- Interior Housing Material: Polycarbonate (PC)
- Exterior Housing Color: -
- Interior Housing Color: Ivory
- Exterior Contact Material: Beryllium Copper
- Interior Contact Material: Phosphor Bronze
- Exterior Contact Finish: Gold
- Interior Contact Finish: Nickel
- Operating Temperature: -
- Ratings: Cat6
- Specifications: -
- Features: Dust Cap, Strain Relief
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