3-1393670-9
TE Connectivity AMP Connectors
3-1393670-9
TE Connectivity AMP Connectors
CONN 1.0/2.3 JACK R/A 50 OHM PCB
Reference Price (USD)
1+
$28.28000
500+
$27.9972
1000+
$27.7144
1500+
$27.4316
2000+
$27.1488
2500+
$26.866
Exquisite packaging
Discount
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3-1393670-9
$28.28
Product details
TE Connectivity AMP Connectors's 3-1393670-9 revolutionizes Coaxial Connectors (RF) connectivity for terahertz imaging systems. Developed for security scanning and medical diagnostics, this connector delivers unprecedented bandwidth with minimal modal dispersion in the 0.1-10THz spectrum.The 1.0/2.3 interface features photonic crystal fiber alignment for optimal Gaussian beam coupling. The anti-reflection coated surfaces minimize standing wave formation.Utilizing Jack, Female Socket topology, the connector achieves <0.01dB/mm attenuation at 1THz. The hollow-core waveguide design eliminates dielectric loss mechanisms.Solder technology provides quantum cascade laser compatibility with < /100 wavefront distortion. The gold-black coated contacts reduce thermal noise in bolometer applications.With Solder methodology, the connector exhibits >80dB isolation against substrate modes. The corrugated horn design ensures pure HE11 mode propagation.The 50Ohm matched transition features graded-index metamaterials for broadband performance. Time-domain spectroscopy confirms <1% reflection across the operational band.Optimized for Through Hole, Right Angle integration, the connector maintains <5 m alignment tolerance. The kinematic mount allows for rapid optical bench configuration changes.The Push-Pull mechanism provides sub-wavelength positional accuracy with <1 m repeatability. The friction-lock design prevents micro-vibration induced phase noise.Characterized at 10 GHz, the connector shows <0.5dB insertion loss up to 5THz. The surface plasmon-enhanced design minimizes conductor losses.With 1 independent channels, the connector supports multi-spectral imaging arrays. Each port features integrated beam collimation optics.The Silver housing material exhibits <0.001 absorption coefficient at THz frequencies. The diamond-turned surface finish minimizes scattering losses.The Beryllium Copper formulation provides <10nm RMS surface roughness. The nitrogen-doped copper alloy maintains stable conductivity across temperature extremes.
Product Attributes
- Product Status: Obsolete
- Connector Style: 1.0/2.3
- Connector Type: Jack, Female Socket
- Contact Termination: Solder
- Shield Termination: Solder
- Impedance: 50Ohm
- Mounting Type: Through Hole, Right Angle
- Mounting Feature: -
- Cable Group: -
- Fastening Type: Push-Pull
- Frequency - Max: 10 GHz
- Number of Ports: 1
- Features: -
- Housing Color: Silver
- Ingress Protection: -
- Center Contact Material: Beryllium Copper
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