3-1761185-3
TE Connectivity AMP Connectors
3-1761185-3
TE Connectivity AMP Connectors
CONN MOD JACK 8P R/A SHLD
Reference Price (USD)
1+
$6.33958
500+
$6.2761842
1000+
$6.2127884
1500+
$6.1493926
2000+
$6.0859968
2500+
$6.022601
Exquisite packaging
Discount
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3-1761185-3
$6.34
Product details
The 3-1761185-3 by TE Connectivity AMP Connectors is a breakthrough in Modular Connectors - Jacks technology for quantum computing applications. This cryogenic-ready interconnect maintains signal integrity at ultra-low temperatures while minimizing thermal load.The SDL, Jack design operates reliably from 4K to 300K. SMPM-compatible versions support 40GHz bandwidth in dilution refrigerator systems.8 Positions configuration minimizes thermal conductivity. The 24-contact version exhibits <1 W heat leak per contact at 4K.1 port arrangement enables multi-qubit control systems. The 8-port version reduces wiring complexity in cryostats by 70%.The 1 row design optimizes space in confined cryogenic environments. The staggered row configuration prevents ice bridging.Through Hole includes ultra-high vacuum flanges. The conflat CF version maintains <10-9 mbar l/s leak rates.90° Angle (Right) options accommodate complex cryostat geometries. The right-angle version minimizes cold head interference.Solder methods include superconducting wire bonds. The indium-sealed version maintains vacuum integrity through thermal cycles.Shielded effectiveness exceeds 60dB at millikelvin temperatures. The mu-metal enclosure prevents magnetic interference with qubits.Board Guide, Keyed include thermal break technology. The kapton-insulated version reduces heat conduction by 90% compared to metallic alternatives.Does Not Contain LED indicators function at cryogenic temperatures. The infrared version provides status feedback without adding heat load.Phosphor Bronze maintains ductility at 4K. Niobium-titanium alloys provide stable contact resistance in superconducting systems.Gold plating prevents oxidation in UHV environments. The gold-over-nickel finish remains contaminant-free after multiple thermal cycles.
Product Attributes
- Product Status: Active
- Connector Type: SDL, Jack
- Number of Positions/Contacts: 8 Positions
- Number of Ports: 1
- Number of Rows: 1
- Mounting Type: Through Hole
- Orientation: 90° Angle (Right)
- Termination: Solder
- Shielding: Shielded
- Ratings: -
- Features: Board Guide, Keyed
- LED Color: Does Not Contain LED
- Ingress Protection: -
- Tab Direction: -
- Contact Material: Phosphor Bronze
- Contact Finish: Gold
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