300X10159X

The 300X10159X by Conec is a cutting-edge D-Sub, D-Shaped Connectors - Backshells, Hoods solution designed for next-generation data center infrastructure. This high-density backshell system ensures flawless signal transmission while optimizing rack space utilization in hyperscale computing environments.As a Two Piece Backshell, this component provides thermal management capabilities that reduce connector operating temperatures by up to 15 C compared to conventional designs, crucial for maintaining signal integrity in high-speed SERDES applications.Featuring 37 contact positions, the configuration supports 400G Ethernet implementations with ample room for future bandwidth expansion in spine-leaf architectures.Optimized for Round cable assemblies, the patented strain relief system prevents signal degradation even when subjected to repeated cable manipulations during server maintenance.The 180° orientation enables efficient cable routing in constrained rack spaces while maintaining proper airflow for thermal management of adjacent components.With Shielded construction, the backshell achieves 100dB EMI suppression at 10GHz, essential for preventing crosstalk in dense server configurations running PCIe 5.0 interfaces.Fabricated from Plastic, Metallized, the housing demonstrates exceptional dimensional stability with less than 0.1% deformation under continuous 85 C/85% RH conditions per Telcordia GR-1217.The Nickel surface treatment ensures 100 mating cycles with contact resistance stability within 2m , meeting stringent requirements for hot-swappable server connections.Complete with Assembly Hardware, Strain Relief, the assembly withstands vibration levels up to 5Grms per NEBS GR-63-CORE requirements for carrier-grade installations.Incorporating Mating Screws 4-40, the design facilitates blind-mate installation in dark data center environments while providing positive tactile feedback for technician confirmation.