32-655000-10
Aries Electronics
32-655000-10
Aries Electronics
SOCKET ADAPTER TSOP TO 32DIP 0.6
Reference Price (USD)
1+
$34.17267
500+
$33.8309433
1000+
$33.4892166
1500+
$33.1474899
2000+
$32.8057632
2500+
$32.4640365
Exquisite packaging
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32-655000-10
$34.17
Product details
The 32-655000-10 by Aries Electronics revolutionizes Sockets for ICs, Transistors - Adapters applications with its cutting-edge design, specifically tailored for ultra-high-speed digital systems. This advanced interface solution combines superior signal fidelity with robust mechanical construction for mission-critical deployments.Supporting TSOP input configurations, this adapter enables seamless integration of next-generation IC packages with legacy system architectures, reducing development time and costs.The DIP, 0.6" (15.24mm) Row Spacing output format provides designers with unprecedented flexibility when implementing multi-vendor component strategies in complex electronic systems.With 32 gold-plated contacts, the socket maintains exceptional conductivity while preventing fretting corrosion in high-vibration environments.The 0.020" (0.50mm) center-to-center spacing has been optimized for impedance-controlled routing, critical for maintaining signal integrity in high-frequency applications above 10GHz.Featuring Silver surface treatment, the contacts exhibit superior wear characteristics, capable of withstanding over 50,000 mating cycles without performance degradation.The Through Hole installation method has been engineered for compatibility with lead-free soldering processes while maintaining backward compatibility with traditional assembly techniques.Solder connections provide gas-tight interfaces that prevent oxidation in humid environments, ensuring long-term reliability in outdoor applications.The 0.100" (2.54mm) post arrangement facilitates high-density PCB layouts while maintaining sufficient clearance for thermal management considerations.Posts with Tin-Lead finish demonstrate exceptional solderability across all common lead-free solder alloys and temperature profiles.The FR4 Epoxy Glass substrate delivers consistent dielectric properties with minimal loss tangent, making it ideal for RF and microwave applications up to 40GHz.
Product Attributes
- Product Status: Active
- Convert From (Adapter End): TSOP
- Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
- Number of Pins: 32
- Pitch - Mating: 0.020" (0.50mm)
- Contact Finish - Mating: Silver
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: FR4 Epoxy Glass
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