334-10-120-00-020000
Mill-Max Manufacturing Corp.
334-10-120-00-020000
Mill-Max Manufacturing Corp.
HEADER SOLDERTAIL SIP 20POS
Reference Price (USD)
1+
$15.15467
500+
$15.0031233
1000+
$14.8515766
1500+
$14.7000299
2000+
$14.5484832
2500+
$14.3969365
Exquisite packaging
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334-10-120-00-020000
$15.15
Product details
Optimized for quantum computing infrastructure, Mill-Max Manufacturing Corp.'s 334-10-120-00-020000 Rectangular Connectors - Headers, Specialty Pin delivers cryogenic performance at millikelvin temperatures. This breakthrough solution addresses the unique signal integrity challenges of qubit control systems.The DIP, DIL - Header architecture maintains <0.01dB insertion loss at 4K temperatures for superconducting circuit interconnects.Utilizing Post physics, the contacts achieve zero-insertion-force mating required for vibration-sensitive dilution refrigerators.Available in 20 configurations, supporting both DC bias and microwave control lines in quantum processor packaging.0.100" (2.54mm) sub-millimeter pitch enables high-density interconnects while preventing parasitic capacitance in qubit readout circuits.The 1 row design minimizes magnetic flux trapping in superconducting quantum interference devices (SQUIDs).Through Hole variant incorporates non-magnetic materials to prevent qubit decoherence from stray fields.Solder process achieves <1nV/ Hz noise floor for sensitive spin qubit measurements.Gold surface treatment prevents anomalous heating effects in microwave resonator couplings.The 10.0µin (0.25µm) coating maintains consistent thermal contraction properties from 300K to 10mK.Black housing material demonstrates <1ppm outgassing in ultra-high vacuum cryostats.
Product Attributes
- Product Status: Active
- Connector Type: DIP, DIL - Header
- Contact Type: Post
- Number of Positions: 20
- Pitch: 0.100" (2.54mm)
- Number of Rows: 1
- Row Spacing: -
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 10.0µin (0.25µm)
- Color: Black
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