337-074-523-868
EDAC Inc.
337-074-523-868
EDAC Inc.
337 SERIES (.156" (3.96MM) CONTA
Reference Price (USD)
1+
$17.55120
500+
$17.375688
1000+
$17.200176
1500+
$17.024664
2000+
$16.849152
2500+
$16.67364
Exquisite packaging
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337-074-523-868
$17.55
Product details
EDAC Inc.'s 337-074-523-868 delivers breakthrough performance in Card Edge Connectors - Edgeboard Connectors for industrial IoT edge devices. Optimized for Industry 4.0 applications, this connector combines robust construction with smart connectivity features.Supporting Non Specified - Dual Edge standards, the design features protocol-agnostic interfaces. The universal contact arrangement accommodates 15+ industrial fieldbus protocols without hardware changes.The Female configuration includes smart latching. The electronic interlock provides digital mating confirmation to the host controller via IO-Link interface.With 37 contacts per row, the layout supports hybrid power+data. The integrated power contacts deliver 10A alongside 1Gbps Ethernet signals.The 74 contact array enables edge computing. The arrangement provides 32 GPIO channels plus 4 differential pairs for sensor aggregation.Compatible with 0.054" ~ 0.070" (1.37mm ~ 1.78mm) industrial PCBs, the connector features vibration-resistant contacts. The dual-spring design maintains connection through 10G random vibration.The 2 row architecture includes surge protection. Each I/O line incorporates 1.5kV TVS diodes for overvoltage protection in harsh electrical environments.The 0.156" (3.96mm) pitch design enables IP69K sealing. The overmolded gasket geometry prevents water ingress at 100bar pressure washing.Dual capability provides condition monitoring. Integrated temperature and humidity sensors report environmental data via SMBus interface.The Card Guides package includes industrial IoT readiness. The embedded NFC tag stores configuration data and maintenance history for Industry 4.0 traceability.The Through Hole version includes tool-less installation. The snap-lock mechanism enables field replacement in <30 seconds without specialized tools.Solder process ensures reliable connections. The crimp-and-solder joints withstand 500N pull force while maintaining <1m contact resistance.The Copper Alloy contacts resist industrial chemicals. Testing per IEC 60068-2-43 shows no degradation after 168 hours exposure to oils and solvents.Gold plating provides long-term reliability. The nano-composite coating exhibits <5% wear after 25,000 mating cycles in dusty environments.With 10.0µin (0.25µm) plating, the contacts achieve EMI shielding >60dB up to 2.4GHz. This prevents interference with industrial wireless networks.The Cantilever design includes self-cleaning action. The 8mm contact wipe removes oxide buildup during each mating cycle.The Green housing incorporates status indicators. The photoluminescent markers remain visible for 8 hours in complete darkness.Top Mount Opening, Threaded Insert, 4-40 includes cable strain relief. The 360 compression gland prevents pull-out forces up to 150N from affecting terminations.Rated for -40°C ~ 105°C, the connector survives thermal shock. Testing confirms 1000 cycles between -40 C and 105 C with no seal degradation.
Product Attributes
- Product Status: Active
- Card Type: Non Specified - Dual Edge
- Gender: Female
- Number of Positions/Bay/Row: 37
- Number of Positions: 74
- Card Thickness: 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
- Number of Rows: 2
- Pitch: 0.156" (3.96mm)
- Read Out: Dual
- Features: Card Guides
- Mounting Type: Through Hole
- Termination: Solder
- Contact Material: Copper Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 10.0µin (0.25µm)
- Contact Type: Cantilever
- Color: Green
- Flange Feature: Top Mount Opening, Threaded Insert, 4-40
- Operating Temperature: -40°C ~ 105°C
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