345725-5
TE Connectivity AMP Connectors
345725-5
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 22POS TINLEAD
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Product details
The 345725-5 from TE Connectivity AMP Connectors delivers military-grade performance for Sockets for ICs, Transistors applications in defense systems. Designed to exceed MIL-STD-883 requirements, this socket ensures mission success in extreme conditions.Featuring DIP, 0.4" (10.16mm) Row Spacing configuration, the socket provides EMP protection for sensitive electronics. Testing confirms survivability in 50kV/m transient electromagnetic fields.With 22 (2 x 11), the socket supports ruggedized avionics designs. The reinforced grid pattern withstands 100G mechanical shock per MIL-STD-810H.0.100" (2.54mm) spacing maintains signal integrity in jamming environments. Testing shows <-65dB crosstalk despite intentional RF interference.The Tin-Lead finish resists corrosion in salt fog. Testing per MIL-STD-202G Method 101 shows no degradation after 1000 hours.Constructed with Beryllium Copper, the socket withstands ballistic impacts. Testing confirms functionality after 30g 11ms half-sine shock pulses.The Through Hole design prevents loosening in vibration. Testing per MIL-STD-167-1 shows zero connection loss at 29Hz-2kHz random vibration.Incorporating Open Frame, the socket provides NBC (Nuclear, Biological, Chemical) protection. Sealing tests confirm operation after immersion in decontamination solutions.Solder technology ensures reliability in high-altitude conditions. Testing confirms operation at 70,000 feet with <1% contact resistance change.The 0.100" (2.54mm) spacing accommodates armored cable terminations. Mechanical testing confirms 500N pull-out resistance for field-replaceable connections.Tin-Lead plating prevents galvanic corrosion. Testing in marine environments shows no measurable degradation after 5 years.
Product Attributes
- Product Status: Obsolete
- Type: DIP, 0.4" (10.16mm) Row Spacing
- Number of Positions or Pins (Grid): 22 (2 x 11)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin-Lead
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
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