350566-3

The 350566-3 by TE Connectivity AMP Connectors pioneers next-generation Terminals - Wire to Board Connectors technology for quantum computing applications. This cryogenic-ready connector system maintains exceptional performance at temperatures down to 4K, enabling reliable interconnects for superconducting quantum processors.Utilizing Through Board, Locking architecture, this solution provides ultra-low thermal conductivity while maintaining precise alignment for microwave signal transmission in dilution refrigerator environments.With 0.072" ~ 0.077" (1.83mm ~ 1.96mm) specifications, the terminal enables perfect impedance matching in superconducting PCB assemblies, critical for qubit control signal integrity.The 0.060" ~ 0.110" (1.52mm ~ 2.79mm) range has been validated for thermal contraction compatibility between room temperature and milliKelvin operating conditions.The 0.250" (6.35mm) profile minimizes parasitic capacitance (<0.1pF) while providing necessary strain relief for delicate superconducting wires.Designed for 18-22 AWG conductors, the terminal exhibits <1nV/ Hz voltage noise contribution at 4K temperatures for precise qubit measurements.Brass selection provides optimal thermal expansion characteristics to prevent contact failure during repeated thermal cycling.The Tin plating process creates an oxide-free surface that maintains stable contact resistance even after prolonged exposure to ultra-high vacuum conditions.