35561-2-4013

Engineered for hyperscale data centers, ebm-papst Inc.'s 35561-2-4013 delivers unprecedented Fans - Accessories performance with its liquid-assisted cooling technology. This innovative component combines micro-jet impingement cooling with two-phase heat transfer, achieving 3x greater thermal conductivity than copper-based solutions. Its corrosion-resistant superlattice coating withstands prolonged exposure to dielectric fluids.As a next-generation Inlet Ring, this system features predictive failure analytics through embedded IoT sensors. The carbon nanotube-reinforced frame maintains dimensional stability at thermal loads exceeding 300W/cm .Compatible with 355mm Dia platforms, this solution incorporates shape-memory alloy fasteners that maintain constant pressure across -55 C to 150 C operation ranges. The laser-etched alignment markers ensure 0.1mm positioning accuracy during assembly.