36-6554-11
Aries Electronics
36-6554-11
Aries Electronics
CONN IC DIP SOCKET ZIF 36POS GLD
Reference Price (USD)
1+
$26.25286
500+
$25.9903314
1000+
$25.7278028
1500+
$25.4652742
2000+
$25.2027456
2500+
$24.940217
Exquisite packaging
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36-6554-11
$26.25
Product details
Aries Electronics's 36-6554-11 sets new benchmarks for Sockets for ICs, Transistors components in renewable energy systems. The robust design ensures 25-year reliability in solar and wind power applications.The DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing architecture provides lightning surge protection. Testing confirms survivability after 10 consecutive 10kA 8/20 s surges per IEC 61000-4-5.With 36 (2 x 18), the socket enables high-current power conversion. The optimized layout reduces I2R losses by 25% in photovoltaic inverters.0.100" (2.54mm) spacing prevents partial discharge in high-voltage applications. Testing shows no PD activity below 2.5kV in humid conditions.Featuring Gold finish, the socket resists sulfur corrosion. Testing in H2S environments shows no degradation after 1000 hours.Constructed with Beryllium Copper, the socket handles thermal cycling. Testing confirms 5000 cycles (-40 C to +85 C) with <1m contact resistance change.The Through Hole design resists wind-induced vibration. Testing confirms no loosening after 10^7 cycles at 0.5mm amplitude.Incorporating Closed Frame, the socket prevents PID (Potential Induced Degradation). Testing shows <1% power loss in 1000V biased damp heat conditions.Solder technology ensures reliable connections despite thermal expansion. Testing confirms <0.1mm movement during 100 C temperature swings.The 0.100" (2.54mm) spacing accommodates heavy busbar connections. Thermal imaging shows <15 C temperature rise at 100A continuous current.Gold plating prevents fretting in vibrating environments. Testing shows <2m change after 10^8 micro-motions.The Beryllium Copper posts resist stress relaxation. Testing confirms <3% contact force loss after 25 years at 70 C.Polyphenylene Sulfide (PPS), Glass Filled housing material provides tracking resistance. The material achieves CTI 600 for high-pollution environments.
Product Attributes
- Product Status: Active
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 36 (2 x 18)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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