370-90-109-00-001000
Mill-Max Manufacturing Corp.
370-90-109-00-001000
Mill-Max Manufacturing Corp.
CONN HDR TURRET 9POS TIN-LEAD
Reference Price (USD)
1+
$13.17700
500+
$13.04523
1000+
$12.91346
1500+
$12.78169
2000+
$12.64992
2500+
$12.51815
Exquisite packaging
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Product details
Mill-Max Manufacturing Corp.'s 370-90-109-00-001000 represents the gold standard in Rectangular Connectors - Headers, Specialty Pin technology, optimized for next-generation 5G infrastructure. This advanced interconnect solution combines millimeter-wave performance with ruggedized construction for outdoor base station deployments.The Header architecture supports 25Gbps data rates when implemented with matched impedance PCB layouts.Utilizing Turret contact geometry, the design minimizes skin effect losses at microwave frequencies up to 40GHz.Scalable from 9 positions, the connector family addresses diverse MIMO antenna array configurations.Precision 0.100" (2.54mm) alignment enables error-free blind mating in rack-mounted RF equipment installations.Dual-row (1 rows) configuration reduces connector footprint by 40% compared to traditional designs.Through Hole variant features integrated shielding cans for EMI suppression in dense cellular radio units.Solder process achieves <0.5dB insertion loss variance across production batches.Tin-Lead surface treatment prevents fretting corrosion in high-humidity environments.The 200.0µin (5.08µm) coating withstands 500+ thermal shock cycles from -55 C to 125 C.Black housing material demonstrates <0.1% water absorption for marine electronics applications.
Product Attributes
- Product Status: Active
- Connector Type: Header
- Contact Type: Turret
- Number of Positions: 9
- Pitch: 0.100" (2.54mm)
- Number of Rows: 1
- Row Spacing: -
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Tin-Lead
- Contact Finish Thickness: 200.0µin (5.08µm)
- Color: Black