387-019-558-607
EDAC Inc.
387-019-558-607
EDAC Inc.
CONN EDGE SGL FMALE 19POS 0.156
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$12.40800
500+
$12.28392
1000+
$12.15984
1500+
$12.03576
2000+
$11.91168
2500+
$11.7876
Exquisite packaging
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387-019-558-607
$12.41
Product details
The 387-019-558-607 from EDAC Inc. represents the pinnacle of Card Edge Connectors - Edgeboard Connectors technology for quantum computing. Precision-engineered for cryogenic operation, this connector maintains signal integrity at temperatures near absolute zero.Compatible with Non Specified - Single Edge configurations, the design features superconducting contacts. When cooled below 4K, the contacts achieve zero DC resistance while maintaining 50 RF characteristics.The Female version includes thermal break technology. The graded transition from room temperature to cryogenic zones minimizes heat leak to <10 W per contact.With 19 contacts per bay, the layout optimizes quantum bus architecture. Each signal path is individually shielded to prevent qubit decoherence.The 19 contact array supports 128-qubit systems. The arrangement provides 40dB cross-talk isolation between adjacent control lines at 10GHz.Designed for 0.054" ~ 0.070" (1.37mm ~ 1.78mm) superconducting boards, the connector features zero-thermal-expansion contacts. The Invar alloy construction maintains 0.1 m alignment from 300K to 4K.The 1 row configuration includes microwave filtering. Each signal line incorporates /4 stubs to suppress noise in the 5-8GHz qubit control band.The 0.156" (3.96mm) pitch design prevents parasitic coupling. Electromagnetic simulations confirm <-50dB nearest-neighbor interaction at 12GHz operating frequency.Single capability enables quantum state measurement. The integrated parametric amplifiers provide 20dB gain with <0.5dB noise figure.Through Hole, Right Angle installation survives repeated thermal cycling. The differential contraction design prevents stress buildup during cooldown from 300K to 4K.The Wire Wrap process creates joint-less connections. The diffusion-bonded interfaces exhibit no Kapitza resistance at cryogenic temperatures.Copper Alloy contacts maintain superconductivity. Critical current density exceeds 10MA/cm at 4K in 1T magnetic fields.The Gold surface treatment prevents oxidation. The atomically smooth finish (<0.5nm RMS) minimizes two-level system (TLS) noise in quantum circuits.With 10.0µin (0.25µm) plating, the contacts achieve <0.01dB insertion loss at 10GHz. This performance is maintained through 1000 thermal cycles.The Cantilever design includes non-invasive probing. The capacitive coupling provides 20fF contact with <1 m penetration depth on superconducting films.The Black housing incorporates RF-absorbent material. The carbon nanotube-loaded composite provides 30dB attenuation of stray microwave photons.Top Mount Opening, Threaded Insert, M3 includes precision alignment guides. The kinematic mount maintains <5 m repeatability during cryostat reconfiguration.Rated for -40°C ~ 105°C, the connector exhibits no outgassing below 10-9 torr. The ultra-high vacuum compatibility prevents qubit contamination.
Product Attributes
- Product Status: Active
- Card Type: Non Specified - Single Edge
- Gender: Female
- Number of Positions/Bay/Row: 19
- Number of Positions: 19
- Card Thickness: 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
- Number of Rows: 1
- Pitch: 0.156" (3.96mm)
- Read Out: Single
- Features: -
- Mounting Type: Through Hole, Right Angle
- Termination: Wire Wrap
- Contact Material: Copper Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 10.0µin (0.25µm)
- Contact Type: Cantilever
- Color: Black
- Flange Feature: Top Mount Opening, Threaded Insert, M3
- Operating Temperature: -40°C ~ 105°C
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