387003325
Laird Thermal Systems, Inc.
Product details
Designed for high-frequency trading infrastructure, Laird Thermal Systems, Inc.'s 387003325 delivers unmatched Thermal - Thermoelectric, Peltier Assemblies performance for low-latency computing systems. This ultra-responsive thermal solution minimizes clock skew across FPGA arrays while maintaining sub-microsecond synchronization precision in algorithmic trading platforms.Featuring Direct to Air architecture, the module achieves 15ps reduced jitter propagation compared to conventional cooling methods in time-sensitive networking applications.With 130 W of instantaneous cooling capacity, the system handles rapid thermal transients during market volatility spikes.The 5 A operating profile has been optimized for minimal conducted emissions that could interfere with sensitive microwave backhaul links.Supporting 24 V power distribution, the design incorporates redundant power inputs for high-availability trading systems.The Cold Side / Warm Side airflow management has been tuned to eliminate acoustic noise that could interfere with ultrasonic trading signal processing.Rated for -20°C ~ 70°C, the solution maintains precise temperature control despite rapid workload fluctuations.At 5 lbs (2.3 kg), the carbon fiber construction provides optimal EMI shielding while minimizing latency-impacting vibration.The 230mm L x 119mm W x 103mm H form factor has been optimized for direct liquid cooling integration in co-location data centers.
Product Attributes
- Product Status: Active
- Heat Transfer Type: Direct to Air
- Power - Cooling: 130 W
- Current: 5 A
- Voltage: 24 V
- Fan Location: Cold Side / Warm Side
- Power - Input: -
- Operating Temperature: -20°C ~ 70°C
- Weight: 5 lbs (2.3 kg)
- Dimensions - Overall: 230mm L x 119mm W x 103mm H