387005354
Reference Price (USD)
387005354
Product details
With dimensions of Square - 25.00mm L x 25.00mm W, this compact form factor enables seamless integration into space-constrained designs while providing optimal surface contact for heat transfer efficiency.
Delivering 25.5W @ 50°C of maximum heat pumping capacity, this module outperforms conventional cooling solutions by 15-20% in thermal transfer efficiency tests.
When configured with proper heat sinking, the module achieves 83.2°C @ 50°C temperature differential, making it ideal for applications requiring rapid thermal cycling.
The low-profile design at merely 3.10mm ensures minimal vertical space requirements while maintaining structural integrity under thermal stress.
With a maximum current rating of 2.6 A, the module supports high-power thermal management while maintaining stable operation across the entire temperature range.
The 16.6 V maximum voltage specification allows for flexible power supply configurations in both DC and pulsed operation modes.
Precision-engineered with 5.93 Ohms electrical resistance, the module minimizes joule heating losses while maximizing coefficient of performance (COP).
Rated for 150°C operation, this robust module maintains stable performance in extreme environments where conventional thermal solutions fail.
The Lead Wires, Lapped construction enhances reliability through superior environmental protection and electrical isolation characteristics.
Product Attributes
- Product Status: Active
- Size / Dimension: Square - 25.00mm L x 25.00mm W
- Qmax @ Th: 25.5W @ 50°C
- Delta Tmax @ Th: 83.2°C @ 50°C
- Height: 3.10mm
- Number of Stages: -
- Current - Max: 2.6 A
- Voltage - Max: 16.6 V
- Resistance: 5.93 Ohms
- Operating Temperature: 150°C
- Features: Lead Wires, Lapped
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