40-3575-11
Aries Electronics
40-3575-11
Aries Electronics
CONN IC DIP SOCKET ZIF 40POS GLD
Reference Price (USD)
1+
$33.33429
500+
$33.0009471
1000+
$32.6676042
1500+
$32.3342613
2000+
$32.0009184
2500+
$31.6675755
Exquisite packaging
Discount
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40-3575-11
$33.33
Product details
Aries Electronics's 40-3575-11 revolutionizes Sockets for ICs, Transistors technology for next-gen automotive electronics. The robust design meets AEC-Q200 Grade 1 requirements while delivering superior electrical performance.The DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing architecture supports advanced driver assistance systems. The unique contact geometry reduces insertion force by 30% while maintaining vibration resistance.With 40 (2 x 20), the socket enables complex ECU designs. The optimized grid pattern minimizes loop inductance in power distribution networks.0.100" (2.54mm) pitch ensures reliable connections in engine control modules. The design prevents fretting corrosion under 50G vibration loads.The Gold finish provides stable contact resistance. Testing under thermal shock conditions (-40 C to 125 C) shows <3m variation.10.0µin (0.25µm) thickness guarantees long-term reliability. Accelerated wear testing predicts 15-year service life in automotive applications.Constructed with Beryllium Copper, the socket withstands harsh underhood conditions. The material maintains spring properties at 150 C continuous operation.The Through Hole configuration simplifies assembly in tight spaces. The low-profile design fits behind instrument panels without compromising serviceability.Incorporating Closed Frame, the socket prevents moisture ingress. IP67 testing confirms complete protection against dust and temporary immersion.Solder technology ensures robust connections in vibrating environments. The design exceeds USCAR-2 vibration standards for automotive connectors.The 0.100" (2.54mm) spacing accommodates heavy copper PCBs. Thermal analysis shows <10 C temperature rise at 20A current loads.Gold plating prevents oxidation in humid environments. Salt spray testing (96 hours) shows no measurable contact degradation.The 10.0µin (0.25µm) finish ensures reliable solder connections. The thickness is optimized for lead-free soldering processes.The Beryllium Copper posts resist stress relaxation. Mechanical testing confirms <5% normal force loss after 10,000 hours at 125 C.Polyphenylene Sulfide (PPS), Glass Filled housing material meets flame retardancy requirements. The material achieves UL94 V-0 rating without halogen additives.
Product Attributes
- Product Status: Active
- Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 40 (2 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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