4003-1G
Aavid, Thermal Division of Boyd Corporation
4003-1G
Aavid, Thermal Division of Boyd Corporation
HEATSINK
Reference Price (USD)
1+
$52.01680
500+
$51.496632
1000+
$50.976464
1500+
$50.456296
2000+
$49.936128
2500+
$49.41596
Exquisite packaging
Discount
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4003-1G
$52.02
Product details
Aavid, Thermal Division of Boyd Corporation's 4003-1G delivers cutting-edge Thermal - Pads, Sheets solutions for next-generation 5G infrastructure. This high-performance thermal interface material addresses the unique thermal management challenges of RF power amplifiers and base station electronics.Optimized for TO-3 applications, this thermal solution maintains stable performance under high-frequency switching conditions. Its low-inductance characteristics make it particularly suitable for RF power devices requiring minimal signal interference.As a premium Pad, Sheet, this product combines exceptional thermal conductivity with excellent EMI shielding properties. This dual functionality simplifies thermal design in sensitive RF applications.Available in precision Rhombus configurations, this material enables optimal thermal pathway design for complex RF modules. The geometrically optimized profiles ensure maximum heat transfer efficiency.Standard 39.65mm x 26.67mm sizes accommodate most common power amplifier packaging requirements. The size-optimized design allows for efficient thermal management in space-constrained base station equipment.With precise 0.0320" (0.813mm) control, this material provides predictable interface performance. The uniform cross-section ensures consistent thermal transfer characteristics across the entire contact area.The advanced Beryllium Oxide Ceramic formulation offers exceptional resistance to high-temperature aging effects. This characteristic ensures long-term reliability in continuous operation scenarios.
Product Attributes
- Product Status: Active
- Usage: TO-3
- Type: Pad, Sheet
- Shape: Rhombus
- Outline: 39.65mm x 26.67mm
- Thickness: 0.0320" (0.813mm)
- Material: Beryllium Oxide Ceramic
- Adhesive: -
- Backing, Carrier: -
- Color: -
- Thermal Resistivity: -
- Thermal Conductivity: -
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