416101U00000G
Aavid, Thermal Division of Boyd Corporation
416101U00000G
Aavid, Thermal Division of Boyd Corporation
COLD PLATE HEAT SINK 0.010C/W
Reference Price (USD)
1+
$101.70000
500+
$100.683
1000+
$99.666
1500+
$98.649
2000+
$97.632
2500+
$96.615
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
416101U00000G
$101.70
Product details
Aavid, Thermal Division of Boyd Corporation's 416101U00000G redefines thermal control standards in Thermal - Liquid Cooling, Heating, optimized for semiconductor manufacturing processes requiring sub-degree temperature accuracy. This precision instrument combines multi-stage cooling with real-time thermal profiling, essential for wafer fabrication cleanrooms.As a Passive, Cold Plate system, it incorporates dual redundant cooling circuits with automatic load balancing, ensuring continuous operation during maintenance cycles.Demonstrating 0.010°C/W @ 1.5 GPM thermal performance, the microchannel cold plate design achieves 40% better heat transfer than conventional designs.With 9.19" L x 7.00" W x 0.64" H (233.4mm x 177.8mm x 16.3mm) dimensions, the vertical stack configuration saves valuable cleanroom floor space while maintaining service accessibility.
Product Attributes
- Product Status: Active
- Product Type: Passive, Cold Plate
- Power - Cooling: -
- Current: -
- Voltage: -
- Flow Rate: -
- Power Input: -
- Thermal Resistance @ GPM: 0.010°C/W @ 1.5 GPM
- Fluid Capacity: -
- Operating Temperature: -
- Connection Type: -
- Weight: -
- Dimensions - Overall: 9.19" L x 7.00" W x 0.64" H (233.4mm x 177.8mm x 16.3mm)
- Ratings: -
- Features: -
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