43700000181000
Laird Thermal Systems, Inc.
Product details
The 43700000181000 by Laird Thermal Systems, Inc. delivers breakthrough performance in Thermal - Thermoelectric, Peltier Assemblies, specifically engineered for hyperscale data center cooling applications. This advanced thermal solution combines phase-change technology with intelligent power management to achieve unprecedented energy efficiency while preserving signal integrity across high-speed SerDes links.Featuring Air to Air architecture, this module demonstrates 28% lower thermal resistance compared to conventional vapor chamber designs when cooling next-gen GPUs in AI training clusters.With 244 W of precise cooling capacity, the system dynamically adjusts to workload variations in cloud computing environments, maintaining junction temperatures within 2 C of target.Operating at 6.1 A, the device implements predictive current shaping to minimize EMI effects on adjacent RF components in 5G baseband units.The 48 V input range supports both 48V rack-level power distribution and 12V board-level conversion topologies common in server designs.The Cold Side / Warm Side airflow configuration has been validated through computational fluid dynamics to eliminate hot spots in 1U chassis configurations.Rated for -40°C ~ 55°C operation, this solution maintains stable performance during data center load spikes and ambient temperature fluctuations.At just 14 lbs (6.4 kg), the lightweight aluminum housing reduces structural load in multi-rack deployments while providing excellent vibration damping.The 400mm L x 153mm W x 204mm H form factor has been optimized for maximum compatibility with Open Compute Project rack standards.
Product Attributes
- Product Status: Active
- Heat Transfer Type: Air to Air
- Power - Cooling: 244 W
- Current: 6.1 A
- Voltage: 48 V
- Fan Location: Cold Side / Warm Side
- Power - Input: -
- Operating Temperature: -40°C ~ 55°C
- Weight: 14 lbs (6.4 kg)
- Dimensions - Overall: 400mm L x 153mm W x 204mm H