438-023-000-112
EDAC Inc.
438-023-000-112
EDAC Inc.
CONN CARDEDGE HSG 23POS .200 GRN
Reference Price (USD)
1+
$8.66560
500+
$8.578944
1000+
$8.492288
1500+
$8.405632
2000+
$8.318976
2500+
$8.23232
Exquisite packaging
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438-023-000-112
$8.67
Product details
The 438-023-000-112 by EDAC Inc. pioneers quantum-ready connectivity in Card Edge Connectors - Housings, featuring cryogenic-compatible materials for quantum computing applications. This specialized connector housing maintains signal integrity at temperatures approaching absolute zero.Compatible with Non Specified - Dual Edge configurations, the housing utilizes superconducting contacts that maintain near-zero resistance at 4K operating temperatures.The 23 arrangement incorporates microwave filtering for qubit control signals, preventing noise infiltration in quantum processor interconnects.Designed for 0.062" (1.57mm) cryogenic modules, the housing features thermal break technology that minimizes heat leakage into superconducting circuits.The 0.200" (5.08mm) pitch configuration accounts for thermal contraction effects, maintaining precise alignment during cooldown from room temperature to 10mK.The Green housing material exhibits ultra-low outgassing properties (<10^-6 torr) suitable for ultra-high vacuum environments in quantum research.With Top Mount Opening, Unthreaded, 0.128" (3.25mm) Dia, the connector achieves hermetic sealing compatible with dilution refrigerator cold plate mounting.Fabricated from Polyphenylene Sulfide (PPS), the housing demonstrates stable dielectric properties across 300K to 4K temperature ranges.
Product Attributes
- Product Status: Active
- Card Type: Non Specified - Dual Edge
- Number of Positions: 23
- Card Thickness: 0.062" (1.57mm)
- Pitch: 0.200" (5.08mm)
- Features: -
- Mounting Type: -
- Color: Green
- Flange Feature: Top Mount Opening, Unthreaded, 0.128" (3.25mm) Dia
- Material - Insulation: Polyphenylene Sulfide (PPS)
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