445548-1
TE Connectivity Aerospace, Defense and Marine
445548-1
TE Connectivity Aerospace, Defense and Marine
CONN D-SUB SOCKET SLDR GOLD
Reference Price (USD)
1+
$0.00000
500+
$0
1000+
$0
1500+
$0
2000+
$0
2500+
$0
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
445548-1
$0.00
Product details
TE Connectivity Aerospace, Defense and Marine's 445548-1 redefines D-Sub, D-Shaped Connectors - Contacts technology for quantum computing applications. These ultra-precision contacts maintain signal integrity at cryogenic temperatures while minimizing thermal conductivity.Specialized for Power quantum bit control systems, the contacts demonstrate <0.1dB insertion loss at 4K temperatures. Comparative testing shows 50% lower thermal load than conventional cryogenic interconnects.The Female Socket configuration utilizes superconducting materials for near-zero resistance. The patented geometry achieves <10n contact resistance at 10mA bias current.Cryo-optimized Machined technology prevents microphonic noise generation. Each contact undergoes helium leak testing to verify <10^-9 mbar l/s leak rates.Solder methods are validated for dilution refrigerator environments. The indium-based system demonstrates 1000+ reliable thermal cycles without performance degradation.Selected Beryllium Copper composition exhibits near-zero magnetoresistance. Material characterization confirms <1ppm magnetic susceptibility at 10T fields.The Gold surface treatment prevents oxidation in ultra-high vacuum. Auger electron spectroscopy confirms <5 oxide layer after 1000 hours at 10^-10 Torr.With 50.0µin (1.27µm) deposition, the contacts achieve stable thermal emf characteristics. Testing shows <0.1 V/K thermal voltage at cryogenic temperatures.The 8 geometry supports high-density qubit addressing with 50 m pitch capability. Cryogenic SEM imaging confirms zero mechanical deformation at 4K operating temperatures.
Product Attributes
- Product Status: Active
- Type: Power
- Contact Type: Female Socket
- Contact Form: Machined
- Wire Gauge: -
- Contact Termination: Solder
- Contact Material: Beryllium Copper
- Contact Finish: Gold
- Contact Finish Thickness: 50.0µin (1.27µm)
- Termination Finish: -
- Termination Finish Thickness: -
- Contact Size: 8
- Features: -
You May Also Be Interested In