5-1542004-4
TE Connectivity AMP Connectors
5-1542004-4
TE Connectivity AMP Connectors
HEAT SINK BGA 21MM 3FIN RADIAL
Reference Price (USD)
1+
$28.67000
500+
$28.3833
1000+
$28.0966
1500+
$27.8099
2000+
$27.5232
2500+
$27.2365
Exquisite packaging
Discount
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5-1542004-4
$28.67
Product details
TE Connectivity AMP Connectors's 5-1542004-4 delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.Optimized for LGA 4677 sockets, the solution manages {Power Dissipation @ Temperature Rise} at server inlet temperatures up to 45 C. The thermal interface maintains performance through 50,000 insertion cycles.The Load Plate system provides uniform pressure distribution (75 5N) across the entire package area. The design prevents PCB warpage in multi-layer server motherboards.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.For cylindrical heat pipes, the 1.375" (34.92mm) OD variant offers 6mm and 8mm options. The design maintains capillary performance at 45 tilt angles common in rack-mounted servers.Precision 0.467" (11.86mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).The 6.00°C/W @ 200 LFM performance is validated under ASHRAE TC9.9 Class A3 conditions. The design maintains stability at airflow rates from 10-25 CFM.The 13.20°C/W specification enables emergency operation during cooling system failures. The design maintains processors below 90 C for 15 minutes without airflow.Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.Nickel-plated surface ensures long-term reliability in data center environments. The finish resists sulfurization and maintains emissivity >0.85 after 5 years of operation.
Product Attributes
- Product Status: Active
- Type: -
- Package Cooled: BGA
- Attachment Method: Clip
- Shape: Cylindrical
- Length: -
- Width: -
- Diameter: 1.375" (34.92mm) OD
- Fin Height: 0.467" (11.86mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
- Thermal Resistance @ Natural: 13.20°C/W
- Material: Aluminum
- Material Finish: Black Anodized
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