5-166053-1

TE Connectivity AMP Connectors's 5-166053-1 sets new benchmarks in D-Sub, D-Shaped Connectors - Contacts performance, developed for next-generation 5G infrastructure. These high-speed contacts feature innovative signal integrity enhancements that push the boundaries of RF connectivity.Specialized for Signal transmission, the contacts maintain 1.5:1 VSWR up to 6GHz. Compared to conventional designs, they reduce crosstalk by 18dB in adjacent channel configurations.The Male Pin implementation utilizes tuned impedance matching for millimeter-wave applications. Proprietary geometry minimizes skin effect losses above 10GHz.Precision Stamped technology ensures consistent RF performance across production batches. Each contact undergoes 100% automated optical inspection for dimensional compliance.Engineered for 20-24 AWG cabling systems, the contacts exhibit excellent return loss characteristics (<-25dB). The strain relief design accommodates 90 bends without impedance discontinuity.Crimp options provide flexibility for mmWave PCB designs. The solder cup variant demonstrates 0.1dB insertion loss advantage at 28GHz in controlled impedance environments.Selected Brass composition delivers optimal high-frequency performance. Material properties are characterized up to 40GHz using TRL calibration standards.The Gold surface treatment achieves <0.5 in roughness for consistent RF performance. Electroless deposition process ensures uniform coating in high-aspect-ratio geometries.With 30.0µin (0.76µm) deposition, the contacts maintain stable contact resistance through thermal cycling (-55 C to +125 C). The finish withstands 100+ reflow cycles at 260 C peak temperature.Tin plating provides excellent solderability for high-frequency PCB materials. The finish composition is optimized for low-PIM applications (<-160dBc).The 20 DF configuration supports multi-gigabit data transmission with <1ps skew. Time-domain reflectometry measurements confirm impedance matching within 5% of nominal value.The Insulation Support integration enables effective heat dissipation in active antenna units. Thermal modeling confirms 15 C temperature reduction compared to conventional designs.