50006-5096ALF
Amphenol ICC (FCI)
50006-5096ALF
Amphenol ICC (FCI)
CONN HEADER HD 96POS PCB
Reference Price (USD)
1+
$13.59463
500+
$13.4586837
1000+
$13.3227374
1500+
$13.1867911
2000+
$13.0508448
2500+
$12.9148985
Exquisite packaging
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50006-5096ALF
$13.59
Product details
The 50006-5096ALF by Amphenol ICC (FCI) revolutionizes Backplane Connectors - Specialized technology, specifically engineered for hyperscale data center applications. This high-density interconnect solution delivers unmatched signal integrity while supporting next-generation computing architectures.Specifically developed for Daughtercard implementations, this series excels in co-packaged optics interconnect applications.Featuring Header, Male Pins configuration, this connector series provides optimal performance for 224G PAM4 signaling in switch fabric applications.The High Density (HDC, HDI, HPC) design incorporates advanced crosstalk suppression techniques, critical for maintaining eye diagram integrity in high-speed serial links.With 96 available positions, this solution enables unprecedented port density for top-of-rack switching equipment.The All loaded variant offers power-efficient solutions for partial population scenarios in server backplanes.The 0.100" (2.54mm) micro-pitch design enables breakthrough density while maintaining impedance control for 112G SerDes channels.3 row configuration supports orthogonal direct-attach copper architectures in disaggregated server designs.The 32 column architecture enables efficient routing of wide parallel buses in memory-centric computing systems.Through Hole installation method ensures precise coplanarity for reliable surface-mount assembly in automated PCB production lines.The Press-Fit process has been optimized for low-void solder joints in mass reflow processes per IPC-7095C standards.Key Mating Guide include integrated heat spreaders and airflow-optimized housings for thermal management in high-performance computing applications.Gold or Gold, GXT™ plating technology provides superior wear resistance exceeding 10,000 mating cycles for data center hot-swap scenarios.30.0µin (0.76µm) coating thickness ensures compliance with IEC 60512-99-001 fretting corrosion requirements.The Black housing material incorporates laser-markable surfaces for traceability in automated manufacturing environments.
Product Attributes
- Product Status: Last Time Buy
- Connector Usage: Daughtercard
- Connector Type: Header, Male Pins
- Connector Style: High Density (HDC, HDI, HPC)
- Number of Positions: 96
- Number of Positions Loaded: All
- Pitch: 0.100" (2.54mm)
- Number of Rows: 3
- Number of Columns: 32
- Mounting Type: Through Hole
- Termination: Press-Fit
- Contact Layout, Typical: -
- Features: Mating Guide
- Contact Finish: Gold or Gold, GXT™
- Contact Finish Thickness: 30.0µin (0.76µm)
- Color: Black
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