50015-1160JLF
Amphenol ICC (FCI)
50015-1160JLF
Amphenol ICC (FCI)
CONN HEADER HD 160POS PCB
Reference Price (USD)
1+
$27.72625
500+
$27.4489875
1000+
$27.171725
1500+
$26.8944625
2000+
$26.6172
2500+
$26.3399375
Exquisite packaging
Discount
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50015-1160JLF
$27.73
Product details
Amphenol ICC (FCI)'s 50015-1160JLF redefines Backplane Connectors - Specialized technology for aerospace satellite payload systems. This space-grade connector solution combines radiation-hardened materials with ultra-high-frequency performance for next-generation communications satellites.Specifically engineered for Daughtercard applications, this series excels in GEO communications payloads.The Header, Male Pins interface configuration meets MIL-DTL-38999 Series III requirements while supporting Ka-band signal transmission.Featuring High Density (HDC, HDI, HPC) technology, this series provides reliable RF performance in vacuum and thermal cycling environments.With 160 contact positions, the connector enables comprehensive payload subsystem integration in smallsat constellations.The All loaded configuration offers mass-optimized solutions for deployable satellite mechanisms.The 0.100" (2.54mm) spacing configuration maintains impedance control for high-speed digital interfaces in satellite processors.4 row design enables efficient packaging for modular satellite bus architectures.The 40 column arrangement supports high-speed data buses in Earth observation payloads.The Through Hole mounting system ensures mechanical stability during launch vehicle vibration profiles.The Solder method has been qualified for wire-wrap reliability in zero-gravity conditions.Key Mating Guide include non-magnetic materials and outgassing-compliant designs for space applications.Gold plating technology exceeds ESA ECSS-Q-ST-70-08C requirements for space connector reliability.30.0µin (0.76µm) coating thickness ensures long-term performance in atomic oxygen environments.The Black housing material provides thermal emissivity properties optimized for spacecraft thermal management.
Product Attributes
- Product Status: Last Time Buy
- Connector Usage: Daughtercard
- Connector Type: Header, Male Pins
- Connector Style: High Density (HDC, HDI, HPC)
- Number of Positions: 160
- Number of Positions Loaded: All
- Pitch: 0.100" (2.54mm)
- Number of Rows: 4
- Number of Columns: 40
- Mounting Type: Through Hole
- Termination: Solder
- Contact Layout, Typical: -
- Features: Mating Guide
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Color: Black
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