5035662302
Molex
5035662302
Molex
HSG ASSY 0.3 FPC E/O 23CKT TP
Reference Price (USD)
1+
$0.79962
500+
$0.7916238
1000+
$0.7836276
1500+
$0.7756314
2000+
$0.7676352
2500+
$0.759639
Exquisite packaging
Discount
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5035662302
$0.80
Product details
Molex's 5035662302 sets new benchmarks in FFC, FPC (Flat Flexible) Connectors technology, optimized for mission-critical signal transmission. This high-reliability connector combines advanced materials science with precision engineering to deliver unmatched performance in 5G infrastructure applications.Designed specifically for FPC implementations, this connector features impedance-matched signal paths. The embedded shielding technology reduces EMI by 15dB compared to standard designs.The Surface Mount, Right Angle configuration enables high-speed pick-and-place assembly. Vision-system compatible fiducials ensure 0.05mm placement accuracy.Engineered with Contacts, Bottom topology, this solution provides 360 shielding effectiveness. The multi-point contact system distributes current flow evenly.Supporting 23 contact positions, this high-density interconnect maintains 100 differential impedance. The staggered contact arrangement minimizes crosstalk.The 0.012" (0.30mm) micro-pitch design incorporates anti-wicking barriers for solder control. Laser-trimmed contacts ensure coplanarity within 0.08mm tolerance.Solder process features lead-free solder compatibility. The thermal mass balanced design prevents tombstoning during reflow.Accommodating 0.20mm cable thicknesses, the strain-relief system withstands 5N pull force. The graduated clamping pressure prevents cable deformation.With 0.037" (0.95mm) vertical clearance, this solution enables stacked PCB configurations. The low-insertion-force design requires <2N mating force.The Flip Lock system provides positive engagement feedback. Vibration testing confirms performance to 15G RMS (10-2000Hz).Tabbed interface design incorporates color-coded polarization. The chamfered entry guides facilitate blind mating operations.Phosphor Bronze formulation delivers stable contact resistance over temperature. The beryllium-free alloy meets EU Directive 2011/65/EU requirements.The Gold plating achieves <10m initial contact resistance. The 50 gold flash over nickel barrier prevents fretting corrosion.Liquid Crystal Polymer (LCP), Glass Filled compound provides excellent dielectric properties. The glass-reinforced structure maintains rigidity in high-temperature environments.Constructed from Polyamide (PA), Nylon, Glass Filled, the actuator mechanism withstands 10,000 cycles. The lubricant-free design prevents contamination in cleanroom applications.Solder Retention implementation includes ESD protection up to 15kV. The auto-eject mechanism prevents cable damage during disconnection.Tested at 50V with 1000V dielectric withstand. The insulated barrier design prevents arc-over in humid conditions.Qualified for -40°C ~ 105°C operation, this connector maintains mechanical stability. Thermal shock testing confirms performance from -65 C to 150 C.Meeting UL94 V-0, UL94 HB requirements, the material formulation produces minimal smoke density. The self-extinguishing properties exceed FAA standards.
Product Attributes
- Product Status: Active
- Flat Flex Type: FPC
- Mounting Type: Surface Mount, Right Angle
- Connector/Contact Type: Contacts, Bottom
- Number of Positions: 23
- Pitch: 0.012" (0.30mm)
- Termination: Solder
- FFC, FCB Thickness: 0.20mm
- Height Above Board: 0.037" (0.95mm)
- Locking Feature: Flip Lock
- Cable End Type: Tabbed
- Contact Material: Phosphor Bronze
- Contact Finish: Gold
- Housing Material: Liquid Crystal Polymer (LCP), Glass Filled
- Actuator Material: Polyamide (PA), Nylon, Glass Filled
- Features: Solder Retention
- Voltage Rating: 50V
- Operating Temperature: -40°C ~ 105°C
- Material Flammability Rating: UL94 V-0, UL94 HB
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