512-9M
Wakefield-Vette
512-9M
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY
Reference Price (USD)
1+
$81.67000
500+
$80.8533
1000+
$80.0366
1500+
$79.2199
2000+
$78.4032
2500+
$77.5865
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
512-9M
$81.67
Product details
The 512-9M from Wakefield-Vette sets new benchmarks for thermal management in Thermal - Heat Sinks for consumer electronics. Designed for slim-profile devices, this solution delivers exceptional cooling performance while meeting stringent aesthetic and acoustic requirements.The Ultra-Thin Vapor Chamber design achieves just {Length} profile height while maintaining 25W/cm heat flux capacity. Compared to traditional heat spreaders, this solution reduces junction temperatures by up to 12 C.Optimized for mobile SoCs and GPU packages, the solution handles {Power Dissipation @ Temperature Rise} in 35 C ambient conditions. The thermal interface maintains performance through 1000+ power cycles.The Pressure-Sensitive Adhesive system allows for tool-less installation with consistent bond strength (3-5N/cm ). The adhesive maintains performance across -20 C to +85 C operating range.Micro-Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in ultra-thin airflow channels. The 0.3mm fin pitch creates optimal boundary layer disruption for maximum heat transfer.The 9.000" (228.60mm) dimension fits within 5mm device profiles while providing sufficient thermal mass. The design prevents hot spot formation in corner-loaded scenarios.With 7.200" (182.88mm) coverage, the solution cools multiple heat sources simultaneously. Thermal imaging shows less than 4 C variation across the entire surface area.Precision 2.350" (59.69mm) of just 0.5mm enables integration in sub-8mm device profiles. The nanostructured surface enhances heat transfer coefficient by 15%.The 0.56°C/W specification enables passive cooling in standby modes. The design maintains surface temperatures below 45 C in still air conditions.High-conductivity graphite laminate provides exceptional in-plane thermal conductivity (800 W/m K). The material is 40% lighter than equivalent aluminum solutions.
Product Attributes
- Product Status: Active
- Type: Top Mount, Extrusion
- Package Cooled: Power Modules
- Attachment Method: Adhesive
- Shape: Rectangular, Fins
- Length: 9.000" (228.60mm)
- Width: 7.200" (182.88mm)
- Diameter: -
- Fin Height: 2.350" (59.69mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: 0.56°C/W
- Material: Aluminum
- Material Finish: -
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